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PCB welding spot repairing method

A repair method and PCB board technology, applied in the field of PCB manufacturing, can solve problems such as low efficiency, waste of PCB boards, low degree of automation integration, etc., and achieve the effect of improving efficiency and ensuring product quality

Inactive Publication Date: 2012-01-11
苏州优纳科技有限公司
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  • Summary
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AI Technical Summary

Problems solved by technology

With the increasing automation of the electronic board manufacturing process, the electronic components are increasingly miniaturized and high-density, and the accuracy of the solder joints on the electronic components is increasing. The current method of manually repairing solder joints with a low degree of automation and integration is often used. It consumes a lot of manpower and material resources, the efficiency is low, and the result of repairing solder joints is not satisfactory; and placing the spot welding robot at the solder joint generation end of the factory will also waste misjudged PCB boards

Method used

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Embodiment Construction

[0012] A kind of repairing method of PCB board solder joint of the present invention, concrete steps are:

[0013] Step 1) Use the color CCD in motion to seamlessly stitch together a panoramic view of the circuit board, and train in the off-string mode to identify the color threshold of the solder joints and solder feet, and use this as the detection standard to solder the circuit boards on the production line through online AOI Points, etc. are automatically detected, and thus three types of circuit boards are classified, one: the PCB boards on the original production line are qualified, and the results identified after automatic AOI detection are still qualified; second: PCB boards on the production line It is qualified, but it cannot be detected as qualified after AOI identification (the proportion of this type is very small), third: the PCB board on the production line is originally unqualified with defects, and it is still unqualified after AOI identification;

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Abstract

The invention discloses a PCB (printed circuit board) welding spot repairing method, which comprises following specific steps: firstly, automatically detecting welding spots of a circuit board on a production line on a line type AOI (Automated Optical Inspection); then manually examining and verifying detected results to eliminate erroneous results that welding spots are defectivein the automatic detection process; and finally automatically sending the examined information about the defective welding spots to a register corresponding to a robot, and utilizing the robot to carry out automatic welding spot repairing work to defective circuit boards produced from the production line through the information. In the PCB (printed circuit board) welding spot repairing method disclosed by the invention, the original manual operation is replaced by the automatic PCB welding spot repairing operation, so that the product quality can be ensured, and meanwhile, the efficiency can be improved.

Description

technical field [0001] The invention relates to the field of PCB manufacturing, in particular to a method for repairing solder joints of a PCB board. [0002] Background technique [0003] PCB boards, that is, printed circuit boards, currently have two situations in the production process: first, after the defective solder joints are detected by the automatic optical detector on the circuit board on the production line, the solder joints are repaired manually; second, The spot welding robot is applied to the welding spot generation end of the factory. With the increasing automation of the electronic board manufacturing process, the electronic components are increasingly miniaturized and high-density, and the accuracy of the solder joints on the electronic components is increasing. The current method of manually repairing solder joints with a low degree of automation and integration is often used. It consumes a lot of manpower and material resources, is inefficient and the ...

Claims

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Application Information

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IPC IPC(8): B23K31/02
Inventor 郑众喜黄春来林彦君刘金辉
Owner 苏州优纳科技有限公司
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