Array temperature touch sensing device

A tactile sensing, array-type technology, applied in thermometers, measuring devices, electrical devices, etc., to achieve the effects of high measurement accuracy, small cross-interference, and high spatial resolution

Inactive Publication Date: 2012-01-18
SOUTHEAST UNIV
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no array temperature tactile sensing device based on temperature-sensitive resistance devices in China.

Method used

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Embodiment Construction

[0034] An array type temperature tactile sensing device, comprising: a temperature sensitive array, a row multiplexer 1 and a column multiplexer 2, and a feedback drive isolation circuit 3, and the temperature sensitive array is composed of M * N The temperature-sensitive resistance Rij distributed in the array as a temperature-sensitive unit is formed, wherein, M is the number of rows, N is the number of columns, i=1, 2, ..., M , j=1, 2,..., N , one end of the temperature sensitive resistor Rij is connected to the y of the row multiplexer Li connected at one end, and the other end is connected to the y of the column multiplexer 2 Hj end connection, row multiplexer 1 a L1 、a L2 ,...,a LM port and column multiplexer 2 b H1 , b H2 ,...,b HN ports are connected with feedback drive isolation circuit 3 output voltage V F connected, column multiplexer 2 a H1 、a H2 ,...,a HN ports are connected to the test voltage V I connected to row multiplexer 1's b L1 , b L2 ,.....

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Abstract

The invention discloses an array temperature touch sensing device, which is characterized by adopting microsize negative temperature coefficient (NTC) temperature sensitive devices (such as temperature-measuring type high-precision NTC resistors) to serve as temperature sensitive units. A temperature sensor array distributed cross structure is adopted; the array distribution can be rectangular, round, elliptical, triangular and the like in shape; one end of each temperature measuring resistor in an array is connected with an alignment on which the temperature measuring resistor is located; the other end of each temperature measuring resistor is connected with a line on which the temperature measuring resistor is located; the number of connecting lines required by detecting N*M temperaturesensors is N+M, thereby, the number of the connecting lines for detecting the temperature sensor array can be greatly reduced. A multi-way electronic analogue switch and a feedback driving isolating circuit are adopted to virtually isolate out all the temperature sensitive resistor devices from the array, and the point temperature is accurately measured through the temperature sensitive resistors, and all temperature points on the array are rapidly measured through carrying out high-speed sweep measurement on all the devices in the array one by one. The array temperature touch sensing device is capable of simultaneously and dynamically measuring temperature signals within a certain spatial range and has the characteristics of high temperature measurement precision, high speed, high spatial resolution and good anti-noise jamming performance.

Description

[0001] technical field [0002] The invention relates to tactile perception in virtual reality technology, in particular to an array-type temperature sensing device, which can realize robot perception of temperature, and belongs to the field of robot measurement and control. Background technique [0003] With the rapid development of electronic information technology, virtual reality technology, as the frontier and hotspot of current information technology research, has become one of the most encouraging information application technologies in the 21st century. "Multiple perception, interactivity and presence" is the goal pursued by an ideal virtual reality system. The importance of technology has been widely recognized and deeply researched. The continuously optimized and perfected haptic algorithm and flexible and textured haptic reproduction device can better simulate the haptic characteristics of virtual scene objects in terms of flexibility and texture, while shape, tac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/24
Inventor 吴剑锋李建清于忠洲
Owner SOUTHEAST UNIV
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