Adhesive tape

Abstract

A manufacturing method comprising a substrate, a first adhesive part, a second adhesive part and an electric device manufactured by using an adhesive tape is provided. An adhesive tape 1 comprises a tape-like substrate material 10 and a tape-like adhesive material 20 provided on the main surface 11 of the substrate material 10. A linear slit 12 for dividing and peeling the substrate material 10 is provided along the longitudinal direction of the substrate material 10. The above adhesive tape is equipped with dispersive electrical conductive particles and the above method comprises the steps of adhering the adhesive tape on a face and a substrate arranged at the opposite side with the substrate material, peeling the region at one side of the substrate material, adhering the first adhesive part and making the first adhesive part in electrical connection with the substrate, peeling the region at the other side of the substrate material, and adhering the second adhesive part and making the second adhesive part in electrical connection with the substrate. The method enables the adhesive tape to be shared and maintain the adhesion of the adhesive tape at the same time.

Description

technical field [0001] The invention relates to an adhesive material tape comprising a base material and an adhesive material. Background technique [0002] Generally speaking, it is used to bond and fix electronic devices such as liquid crystal screens, PDP (plasma display screens), EL (fluorescent display) screens, and double-chip mounting to circuit boards, or to bond and fix circuit boards to electrically connect electrodes to each other. One of the methods is to use a tape of adhesive material. For example, Patent Document 1 and Patent Document 2 disclose an adhesive material tape in which an electrode connection adhesive material is applied to a base material. [0003] Patent Document 1: JP-A-2001-284005, [0004] Patent Document 2: JP-A-2004-200605. [0005] However, applications of adhesive material tapes range from IC drive applications to power supply applications, and it is not unusual to use two or more types of adhesive material tapes according to application...

AI Technical Summary

Problems solved by technology

Therefore, there is a risk that the adhesion of the adhesive material will be reduced due to the adhesion of dust and moisture in the air to this part, and there is a risk of poor bonding of the other side of the adhered member.

In order to avoid this problem, it is also conceivable to change the bonding process of the parts to be bonded, but there are also occasions where it is not necessary to change the production process.

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