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Lighting method and device of LED (light-emitting diode)

A technology of LED lighting and light-emitting devices, which is applied in the direction of lighting devices, components of lighting devices, cooling/heating devices of lighting devices, etc., and can solve problems such as inability to conduct heat through LEDs, reduce LED luminous efficiency, and low light utilization efficiency. To achieve the effect of improving heat dissipation, avoiding the reduction of LED luminous efficiency, and improving luminous efficiency

Inactive Publication Date: 2012-01-25
GUIZHOU GUANGPUSEN PHOTOELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In order to solve the heating problem of LEDs, there is currently a technology of immersing the LED integrated module in a thermal fluid, such as the invention patent with the Chinese patent application number 201010515668.1, which describes that the LED integrated module is immersed in a thermal fluid to improve the integrated module. The heat conduction conditions, but its defect is: there is fluorescent powder on the LED chip in the LED integrated module and the sealant is cured on its surface. This layer of cured material has poor thermal conductivity and cannot quickly conduct the heat of the LED to the thermal fluid; secondly, The phosphor powder on the sealant is affected by the short-distance heating of the LED for a long time and is easy to age, thereby reducing the luminous efficiency of the LED; third, under the action of the electrodes, the entire LED chip is emitting light, but the traditional LED integrated module only emits light from the front part. Utilization, light utilization efficiency is low

Method used

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  • Lighting method and device of LED (light-emitting diode)
  • Lighting method and device of LED (light-emitting diode)
  • Lighting method and device of LED (light-emitting diode)

Examples

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Embodiment 1

[0021] Example 1. The invention relates to an LED lighting and lighting method, in which the exposed LED chip without sealing glue is placed in the air in a transparent insulating heat-conducting fluid, so as to improve the luminous efficiency and heat-conducting effect of the LED chip and reduce light decay. Fix the LED chip 5 on the transparent support 4 without covering the sealing glue, the chip is exposed, the transparent support 4 is supported by the electrode support 3, and suspended in the transparent insulating heat transfer fluid 7 added with phosphor powder, after the LED chip 5 emits light, The phosphor powder irradiated into the transparent insulating thermal fluid 7 reflects the required spectrum and color. The transparent insulating heat-conducting fluid 7 is sealed in the space formed between the transparent cover 6 and the heat-conducting bottom plate 2. When the LED is heated during operation, the transparent insulating heat-conducting fluid 7 is heated to ge...

Embodiment 2

[0023] Example 2. The dimming method of the aforementioned LED lighting luminescence, such as figure 2 As shown, the LED light-emitting component composed of the aforementioned LED chip 5, transparent support 4, electrode support 3, metal reflective foil 1 and heat-conducting bottom plate 2 is suspended and immersed in a transparent insulating heat-conducting liquid 7 containing fluorescent powder. The transparent insulating thermal fluid 7 is placed in a transparent container 8 . Different luminescent effects can be obtained by configuring different phosphor powders in the transparent insulating thermal fluid. When configuring transparent insulating thermal fluid mixed with different phosphors, different luminous effects will be obtained. Since it is more convenient to configure transparent insulating heat-conducting fluids with different phosphors, the configuration of the liquid fluorescent lighting solution for LEDs is more economical and convenient than the existing so...

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Abstract

The invention discloses a lighting method and device of an LED (light emitting diode). An LED chip with a naked chip and no sealing adhesive is hung up and placed in transparent insulated conductive liquid so as to improve the lighting efficiency and heat-conducting effect of the LED chip and reduce the light attenuation. By adopting the method and the device, the heat-dissipating capacity of the LED can be improved, the lighting efficiency of the LED can be improved and the light utilization ratio of the LED can also be improved.

Description

technical field [0001] The invention relates to an LED lighting lighting method and device, and belongs to the technical field of LED lighting. Background technique [0002] In order to solve the heating problem of LEDs, there is currently a technology of immersing the LED integrated module in a thermal fluid, such as the invention patent with the Chinese patent application number 201010515668.1, which describes that the LED integrated module is immersed in a thermal fluid to improve the integrated module. The heat conduction conditions, but its defect is: there is fluorescent powder on the LED chip in the LED integrated module and the sealant is cured on its surface. This layer of cured material has poor thermal conductivity and cannot quickly conduct the heat of the LED to the thermal fluid; secondly, The phosphor powder on the sealant is affected by the short-distance heating of the LED for a long time and is easy to age, thereby reducing the luminous efficiency of the LE...

Claims

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Application Information

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IPC IPC(8): F21V29/00F21V7/22F21V9/10F21Y101/02F21V9/40F21V29/56
Inventor 张继强张哲源
Owner GUIZHOU GUANGPUSEN PHOTOELECTRIC
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