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150W load sheet of high-power aluminum nitride ceramic substrate

A technology of aluminum nitride ceramics and aluminum nitride substrates, applied in the direction of electrical components, circuits, waveguide devices, etc., can solve the convenience of welding and the impact of welding firmness, increased return loss, load burnout, etc. Problems, achieve excellent return loss characteristics, consolidate the ability to withstand power, and increase the effect of area

Inactive Publication Date: 2012-01-25
苏州市新诚氏通讯电子股份有限公司
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out.
In the actual use of the aluminum nitride ceramic substrate load sheet, it is necessary to have a lead wire welded to the pad of the load sheet. At present, most of the market adopts the design process of small pads, because the enlargement of the pad will directly affect the quality of the product. The return loss increases the return loss, but if a small pad is used, the convenience of welding and the firmness of welding will be adversely affected

Method used

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  • 150W load sheet of high-power aluminum nitride ceramic substrate
  • 150W load sheet of high-power aluminum nitride ceramic substrate

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Embodiment Construction

[0012] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0013] Such as figure 1 As shown, the high-power aluminum nitride ceramic substrate 150 watt load chip includes a 9.55*6.35**1MM aluminum nitride substrate 1, the back of the aluminum nitride substrate 1 is printed with a back guide layer, and the front of the aluminum nitride substrate is printed There are wires 2 and several resistors 3, several resistors 3 are connected in parallel through the wires 2 to form a load circuit, and the ground terminal of the load circuit is electrically connected to the back conductive layer through silver paste, so that the load circuit can be grounded to form a loop. A pad is provided on the load circuit, and the size of the pad is 1.2*3mm. The back conducting layer and the wire 2 are printed with conductive silver paste, and the resistors are printed with resistive paste. A protective glass film 4 is pri...

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Abstract

The invention discloses a 150W load sheet of a high-power aluminum nitride ceramic substrate, which comprises a 9.55*6.35*1mm aluminum nitride substrate, wherein a back conduction layer is printed on the back surface of the aluminum nitride substrate, a plurality of resistors and a lead are printed on the front face of the aluminum nitride substrate, the resistors are connected in parallel through the lead to form a load circuit, the grounding end of the load circuit is electrically connected with the back conduction layer, and a welding pad is arranged on the load circuit. The 9.55*6.35*1mm aluminum nitride substrate is adopted as a substrate of the 150W load sheet of the aluminum nitride ceramic substrate, the load circuit adopts a design process of connecting the resistors in parallel without adopting the traditional design process of the single resistor, therefore, the area of the resistors can be effectively increased to ensure that the capacity of the load sheet bearing the power is further enhanced; meanwhile, the design process ensures that the misplacement distribution of the lead breaks through the limit of the traditional design, therefore, the welding pad has excellent return loss characteristic while enlarging, and more convenient and firm welding is realized due to the enlarging of the welding pad.

Description

technical field [0001] The invention relates to an aluminum nitride ceramic substrate load sheet, in particular to a high-power aluminum nitride ceramic substrate 150W load sheet. Background technique [0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out. In the actual use of the aluminum nitride ceramic substrate load sheet, it is necessary to have a lead wire welded to the pad of the load sheet. At present, most of the market adopts the design process of small pads, because the enlargement of the pad will directly affect the quality of the product. The return loss increases the return loss, but if a small pad is used, the convenience of welding and the firmness of welding will be adversely affected. Contents of the invention [0003] Aiming...

Claims

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Application Information

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IPC IPC(8): H01P1/22
Inventor 郝敏
Owner 苏州市新诚氏通讯电子股份有限公司
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