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Large-power aluminum-nitride-ceramic substrate 250-watt loading sheet with impedance of 50 ohms

A technology of aluminum nitride ceramics and aluminum nitride substrates, applied in electrical components, circuits, waveguide devices, etc., can solve the problems of not meeting the requirements of miniaturization of base stations, health hazards of production personnel, environmental pollution, etc., to avoid Injury, pollution reduction, product size reduction effect

Inactive Publication Date: 2012-01-25
苏州市新诚氏通讯电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the domestic power can reach 250 watts. One kind of load chip is to use BeO material. This material is poisonous. It is easy to pollute the environment during the production process and bring certain harm to the health of production personnel.
The other is to use a larger-sized aluminum nitride substrate, which does not meet the miniaturization requirements of the current base station
At present, there is basically no application of aluminum nitride substrates in China to make a load chip that can withstand 250W power on a size of 16*6*1mm.

Method used

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  • Large-power aluminum-nitride-ceramic substrate 250-watt loading sheet with impedance of 50 ohms
  • Large-power aluminum-nitride-ceramic substrate 250-watt loading sheet with impedance of 50 ohms

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Embodiment Construction

[0012] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0013] Such as figure 1 As shown, the impedance is a 50Ω high-power aluminum nitride ceramic substrate 250 watts load sheet, which includes a 16*6*1mm aluminum nitride substrate 1, the back of the aluminum nitride substrate 1 is printed with a back conductive layer, and the aluminum nitride Resistors and wires 2 are printed on the front of the substrate, and the wires are connected to the resistors to form a load circuit. The load circuit includes two symmetrically arranged first resistors 3 and two symmetrically arranged second resistors 4, the first resistor 3 on the left is connected in series with the second resistor 4 on the left to form a first load branch, and the right one The first resistor 3 and the second resistor 4 on the right are connected in series to form a second load branch, and the first load branch and the second load bra...

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Abstract

The invention discloses a large-power aluminum-nitride-ceramic substrate 250-watt loading sheet with an impedance of 50 ohms. The substrate comprises an aluminum nitrate substrate with the size of 16*6*1 mm. A back guide layer is printed in the front of the aluminum nitrate substrate and a resistor and a wire are printed in the front of the aluminum nitrate substrate; the wire is connected with the resistor to form a loading circuit and a ground terminal of the loading circuit is electrically connected with the back guide layer; and the resistor is printed with a glass protection film. The loading sheet can bear the load of 250 watts on the aluminum nitrate substrate with the size of 16*6*1 mm so that the size of the loading sheet is greatly reduced and the requirements of small size and large power are met; and furthermore, the size of the product of a client is further reduced. Meanwhile, with the adoption of the aluminum-nitride-ceramic substrate loading sheet with the structure, the traditional loading sheet made of BeO material can be replaced so that the pollution to the environment can be effectively reduced and the damages to the physical health of production staff are avoided.

Description

technical field [0001] The invention relates to a loading sheet of an aluminum nitride ceramic substrate, in particular to a 250-watt loading sheet of an aluminum nitride ceramic substrate with an impedance of 50Ω. Background technique [0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out. At present, most communication base stations use high-power ceramic load chips to absorb the reverse input power of communication components, requiring the basic size to be smaller and smaller, while the power to be absorbed is getting larger and larger. [0003] At present, the domestic power can reach 250 watts. One is to use BeO material. This material is poisonous, and it is easy to pollute the environment during the production process and bring certain ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/22
Inventor 郝敏
Owner 苏州市新诚氏通讯电子股份有限公司