Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article

A technology for epoxy resin, epoxy resin, applied in the direction of epoxy resin glue, plastic/resin/wax insulator, adhesive, etc.

Active Publication Date: 2012-01-25
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, properties such as long-term storage stability and low-temperature short-time curability ...

Method used

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  • Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article
  • Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article
  • Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article

Examples

Experimental program
Comparison scheme
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Embodiment

[0389] This invention is demonstrated based on an Example.

[0390] In addition, in the following physical property measurements, evaluations were ◎, ○, △, ×, and ××, but in the specification of the present application, as long as ◎, ○, and △ were evaluated, they were evaluated as sufficient values ​​for obtaining the effects of the present application.

manufacture example 1-1～1-10

[0392] In the solvent shown in Table 2, under the conditions of reaction solution concentration and reaction temperature shown in Table 2, the epoxy resin (e1) and the hydrocarbon group having more than one primary amino group and / or aliphatic or alicyclic Or secondary amino amine compound reaction. Thereafter, the solvent was distilled off under reduced pressure to obtain amine adducts or bulk curing agents for epoxy resins h-1 to h-10 mainly composed of amine adducts. In addition, the evaluation result of the hardening|curing agent for epoxy resins h-1-h-10 which obtained block shape is collectively described in Table 2.

[0393] In addition, unless otherwise specified, "triethylenetetramine" and "tetraethylenepentamine" described in the tables of the examples are reagents manufactured by Wako Pure Chemical Industries, and each is ethyleneamine. mixture. As these charging amounts at the time of reaction, the equivalent in terms of triethylenetetramine and tetraethylenepent...

manufacture example 2-1

[0401] Add tert-butyl hydroquinone 166g (1 mole), epichlorohydrin 1850g (20 moles), glycidol 296g (4 moles), tetramethyl chloride Ammonium 0.55g, addition reaction under heating and reflux for 2 hours. Next, the content was cooled to 60° C., a water removal device was installed, and 183 g (2.2 mol) of 48.5% sodium hydroxide was added thereto. The generated water was continuously azeotropically removed under conditions of a reaction temperature of 55-60° C. and a reduced pressure of 100-150 mmHg, and a ring-closure reaction was carried out while returning the epichlorohydrin layer in the distillate to the reaction system. The point at which generated water reached 56.5 ml was defined as the end point of the reaction. Thereafter, vacuum filtration and water washing were repeated, and residual epichlorohydrin was recovered by vacuum distillation to obtain a crude epoxy resin.

[0402] The obtained crude epoxy resin was subjected to repeated vacuum distillation to obtain highly ...

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Abstract

A microencapsulated hardener for epoxy resins which comprises cores comprising an epoxy-resin hardener and shells covering the cores, characterized in that the epoxy-resin hardener comprises as a major component an amine adduct obtained by the reaction of an epoxy resin (e1) with an amine compound, the epoxy-resin hardener has an overall amine value of 370 to 1,000, the epoxy-resin hardener has an average particle diameter of 0.3-12 [mu]m, excluding 0.3 [mu]m, and the shells have, on at least the surface thereof, a combined group (x) that absorbs infrared rays having a wavenumber of 1,630-1,680 cm-1, a combined group (y) that absorbs infrared rays having a wavenumber of 1,680-1,725 cm-1, and a combined group (z) that absorbs infrared rays having a wavenumber of 1,730-1,755 cm-1.

Description

technical field [0001] The present invention relates to a novel curing agent for epoxy resins, a one-component epoxy resin composition using the same, and the like. Background technique [0002] Epoxy resin is widely used in coatings, electrical and electronic insulating materials, adhesives, etc. Widely used. [0003] Here, as an epoxy resin composition used for such an application, it is usually a so-called two-component epoxy resin composition (or a description of For "two-component epoxy resin composition"). However, although the two-component epoxy resin composition can be cured well at room temperature, it is necessary to store the epoxy resin and the curing agent separately, and it is necessary to mix them after weighing them separately at the time of use. In addition, since the potable time after mixing the epoxy resin and curing agent is limited, it is impossible to mix the two in large quantities in advance. That is, the conventional two-component epoxy resin c...

Claims

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Application Information

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IPC IPC(8): C08G59/50C09D201/00C09J7/00C09J201/00H01B3/40C09J7/20
CPCC08J3/22C08G59/184C08J2363/00C09J163/00C08L63/00C09J2203/326C09J2463/00C09J7/20C08G59/50C08K9/10
Inventor 山本久尚近藤义公相川一之
Owner ASAHI KASEI KK
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