Single-component photo-curable and thermal-curable adhesive and preparation method thereof

A double-curing, one-component technology, applied in the direction of modified epoxy resin adhesives, etc., can solve the problem that the shadow part cannot be completely cured, and achieve the effect of wide application range, uniform reaction system and excellent performance

Inactive Publication Date: 2012-02-01
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The beneficial effects of the present invention are: the adhesive of the single-component photothermal dual-curing agent of the present invention completely solves the problem that conventional light-curing adhesives cannot be completely cured in the shadow part, and the vinyl epoxy resin contains both acrylate and ring. The characteristics of oxygen groups can make the light curing reaction and thermal curing reaction well combined, so that the reaction system is uniform, the cured product has excellent performance, high bonding reliability, and a wide range of applications

Method used

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  • Single-component photo-curable and thermal-curable adhesive and preparation method thereof
  • Single-component photo-curable and thermal-curable adhesive and preparation method thereof
  • Single-component photo-curable and thermal-curable adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0019] Accurately weigh each raw material according to the following weight percentages, bisphenol A epoxy resin: 5%, vinyl epoxy resin: 5%, polyurethane acrylate oligomer: 45%, IBOA: 40%, photoinitiator: 184 : 3%, latent curing agent imidazole: 2%; put the above components into the double planetary power mixing mixer in turn, vacuumize to -0.08MPa, stir at 500 rpm for 2 hours, stir evenly, naturally Let it cool down to room temperature to obtain a one-component adhesive capable of dual curing with light and heat, and then seal and pack it.

Embodiment 2

[0021] Accurately weigh each raw material according to the following weight percentages, bisphenol F epoxy resin: 10%, vinyl epoxy resin: 10%, epoxy acrylate oligomer: 28%, THFAA: 35%, photoinitiator: TPO: 3%, latent curing agent dicyandiamide: 7%, latent curing agent dicyandiamide: 7%; add the above components into the double planetary power mixing mixer in turn, and vacuum until the vacuum degree is -0.05MPa , stirred at 750 rpm for 1 hour, stirred evenly, let it air naturally to room temperature, and obtained a single-component light-heat dual-curable adhesive, which can be sealed and packaged.

Embodiment 3

[0023] Accurately weigh each raw material according to the following weight percentages, cycloaliphatic epoxy resin: 2%, vinyl epoxy resin: 2%, polyester acrylate: 50%, HDDA: 40%, photoinitiator 1173: 3%, Photoinitiator TPO: 2.5%, latent curing agent dicyandiamide: 0.5%; add the above components into the double planetary power mixer in turn, vacuumize to -0.06MPa, stir at 700 rpm for 1.5 hour, stir evenly, and let it air naturally to room temperature to obtain a single-component light-heat dual-curable adhesive, which can be sealed and packaged.

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Abstract

The invention relates to a single-component photo-curable and thermal-curable adhesive and a preparation method thereof. The single-component photo-curable and thermal-curable adhesive consists of the following components in percentage by weight: 1 to 10 percent of epoxy resin, 1 to 10 percent of vinyl epoxy resin, 15 to 60 percent of acrylate oligomer, 20 to 50 percent of acrylate active diluent, 2 to 7 percent of photoinitiator and 0.5 to 7 percent of latent curing agent. The preparation method for the single-component photo-curable and thermal-curable adhesive comprises the following stepsof: weighing a proper amount of epoxy resin, vinyl epoxy resin, acrylate oligomer, acrylate active diluent, photoinitiator and latent curing agent in percentage by weight, adding into a stirrer in turn, uniformly stirring in vacuum, naturally cooling to room temperature, and performing sealing packaging.

Description

technical field [0001] The invention relates to a curing agent, in particular to a single-component light-heat dual-curable adhesive and a preparation method thereof, which are suitable for bonding applications of light-shielding or translucent materials, and belong to the field of adhesives. Background technique [0002] Light-curing adhesives have been widely studied due to their outstanding advantages such as fast curing speed, environmental friendliness, low energy consumption, and no solvent volatilization, and they are rapidly promoted in various industries. However, light-curing adhesives also have their own limitations. Translucent materials or component shading parts absorb, block and reflect ultraviolet light. Photoinitiators often have low initiation efficiency, and the adhesive is not easy to cure completely, which greatly reduces the mechanical properties of the adhesive layer. . [0003] In order to solve the disadvantage that the shadow part cannot be cured d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/10
Inventor 潘光君王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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