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Method for quickly unsealing small component

A component and fast technology, applied in the field of failure analysis, can solve the problems of unsealable and unsealed components at fixed points, and achieve the effects of convenient electrical testing, cost saving and low cost

Inactive Publication Date: 2012-02-01
SHANGHAI FALAB TEST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problems in the prior art that fixed-point unsealing of components cannot be realized and the cost of unsealing is high, the present invention provides the following technical solutions:

Method used

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Embodiment Construction

[0022] The process embodiment will be described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0023] A method for quickly unpacking small components, the method comprising the following steps:

[0024] A. Confirm the component samples that need to be unpacked, take photos of the samples and X-ray photos, and determine the corresponding chip position according to the X-ray photos;

[0025] B. Use tinfoil to wrap and fix multiple component samples that need to be unsealed on the metal strip, and at the same time ensure that the metal strips that fix the components are completely covered by tinfoil, and remove the tinfoil that needs to be unsealed on the component samples;

[0026] C. Use fuming nitric acid and sulfuric acid to prepare the corrosion solution for unsealing in proportion, and heat the corr...

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Abstract

The invention provides a method for quickly unsealing a small component, which comprises the steps that: A. a component sample to be unsealed is confirmed, and the position of a corresponding chip is determined; B. a foil is used for fixedly wrapping the component sample, and the foil on the position on the component sample to be unsealed is removed; C. corrosive liquid for unsealing is prepared and heated; D. a plastic seal of the component sample is removed; E. the unsealing is observed; and if the plastic seal is not fully removed, Step E is repeated until the plastic seal is removed thoroughly; and F. the component is arranged in ultrasonic wave to be cleaned and dried, and the unsealing of the component is completed. The method can simultaneously unseal a plurality of component samples and has high unsealing efficiency. By using the method, the position and the size to be unsealed can be randomly determined, the pins of the component samples are ensured not to be corroded, a follow-up electrical test is convenient to conduct, the corrosion degree of the component sample can be observed at any time, and lines are ensured not not to damaged.

Description

[0001] technical field [0002] The invention relates to the field of failure analysis, in particular to a method for simultaneously unsealing multiple plastic-encapsulated components. [0003] Background technique [0004] The unsealing test is a destructive test, mainly for packaged devices. For components packaged with epoxy resin, mixed acid is generally used to etch the package outside the component to expose the chip, in preparation for subsequent experiments. The industry generally uses an automatic unsealing machine to open the seal, or to weld the components on the copper frame. When welding, the copper frame is generally dipped in flux, and then inserted into the tin furnace. On the surface, use tweezers to hold the components and dip them in flux, put them on the frame, and after all the components are soldered, put the components into the prepared mixed acid and unseal. The advantage of automatic unsealing machine is that it is safer and more convenient. The d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/02G01B15/00
Inventor 康燕荣
Owner SHANGHAI FALAB TEST
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