Substrate cleaning apparatus, coating and developing apparatus having the same and substrate cleaning method

Abstract

The present disclosure relates to a substrate cleaning apparatus, a coating and developing apparatus and a substrate cleaning method. The space-saving substrate cleaning apparatus is capable of cleaning a beveled portion easily and efficiently. The substrate cleaning apparatus in the embodiment includes a substrate holding and rotating unit for holding a center of a rear surface of a substrate and rotating the substrate; a cleaning unit including a first cleaning member, a second cleaning member provided around the first cleaning member and a base to which the first and second cleaning members are secured; an elevating unit for moving the substrate holding and rotating unit and the cleaning unit relative to each other so as to allow the first and second cleaning members to come into contact with the rear surface of the substrate held by the substrate holding and rotating unit; and a driving unit for driving the substrate and the cleaning unit relative to each other in a direction along the rear surface of the substrate so as to allow part of the second cleaning member to be exposed to the outside of the substrate.

Description

technical field [0001] The present invention relates to a substrate cleaning device for cleaning substrates such as semiconductor wafers and flat panel display glass substrates (FPD substrates), a coating and developing device having the substrate cleaning device, and a substrate cleaning method. Background technique [0002] In the manufacturing process of semiconductor integrated circuits and FPDs, photolithography is indispensable for forming a photoresist pattern used as an etching mask on a substrate. In photolithography, specifically, a photoresist film is formed by coating a photoresist liquid on a substrate such as a semiconductor wafer or an FPD substrate, and a photomask (mask) with a predetermined pattern is used. mold) to expose the photoresist film, and develop the exposed photoresist film to form a photoresist pattern. For such processing, a photoresist pattern forming system configured by connecting an exposure device to a coating and developing device for co...

AI Technical Summary

Problems solved by technology

[0006] However, in the case where the chamfering grinding mechanism is provided in the substrate cleaning unit as described above, since a space for installing the chamfering grinding mechanism is required in the substrate cleaning unit, the substrate cleaning unit tends to be enlarged.

Therefore, the occupied area of ​​the coating and developing device having the substrate cleaning unit also becomes larger.

In addition, since the operation of the chamfering and grinding mechanism requires a predetermined time, it leads to a decrease in the manufacturing productivity of semiconductor integrated circuits and the like.

In addition, since the manufacturing cost of the chamfering and grinding mechanism is required, the manufacturing cost of the substrate cleaning unit and the coating and developing device having the substrate cleaning unit increase, which in turn leads to an increase in the manufacturing cost of semiconductor integrated circuits and the like.

Images