Composite liquid absorption core of heat dissipation heat pipe and manufacture method thereof

Abstract

The invention discloses a composite liquid absorption core of a heat dissipation heat pipe and a manufacture method thereof; the composite liquid absorption core comprises red copper powder particles and red copper fibres; double-pore structures are formed among the copper powder particles, among the red copper fibres and among the red copper powder particles and the red copper fibres, wherein fine pores are formed among the red copper powder particles; large pores are formed among the red copper powder particles and the red copper fibres; and the red copper fibres are not connected. The manufacture method comprises the following steps of: forming a spatial range of the liquid absorption core at first, and uniformly filling the mixture of the red copper powder particles and the red copperfibres; placing the mixture in a vacuum protective sintering furnace to sinter at 900-1000 DEG C for 30-120 min; and cooling the furnace to room temperature, disassembling other auxiliary structural devices, and then obtaining the composite liquid absorption core. According to the composite liquid absorption core of the heat dissipation heat pipe and the manufacture method thereof disclosed by the invention, the manufacture method is simple; the production cost is low; the disadvantages of the current liquid absorption core of the heat pipe are overcome; and the composite liquid absorption core of the heat dissipation heat pipe, which is high in capillary pressure, low in backflow resistance and low in thermal resistance, is provided.

Description

technical field [0001] The invention relates to a heat pipe for heat transfer, in particular to a composite liquid-absorbing core structure of a heat pipe for heat dissipation and a manufacturing method thereof. Background technique [0002] Heat pipes have become ideal components for heat dissipation of chips with high heat flux. However, with the development of further miniaturization and integration of electronic chips, the heat dissipation of electronic products has higher requirements on the heat transfer performance of heat pipes. Therefore, the performance of heat pipes should be improved. Still key. The heat transfer performance of the heat pipe is mainly determined by the structure of the capillary wick. At present, the commonly used wick structures include: wire mesh type, groove type and sintered type. The sintered liquid-absorbing core has a large capillary suction force and large heat transfer, but there is a contradiction that the liquid return resistance incr...

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Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies of the existing heat pipe liquid-absorbent core, and propose a heat pipe composite liquid-absorbent core with high capillary pressure, small return resistance and low thermal resistance, and the manufacturing process of this liquid-absorbent core is simple, and the equipment requirements are low. low cost

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