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Light-emitting diode assembly and packaging method thereof

A technology for light-emitting diodes and packaging methods, which is applied to electrical components, electrical solid-state devices, semiconductor devices, etc., can solve the limitations of increasing the processing and manufacturing cost of light-emitting diode components, the size of high-power light-emitting diode components, photoelectric conversion efficiency and heat dissipation efficiency, The power performance of the LED module is not as good as expected, etc.

Inactive Publication Date: 2012-02-08
普照光电科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] This not only increases the processing and manufacturing cost of LED components, but also due to the relatively large volume of a single LED package, coupled with the heat dissipation requirements of high-power LED components, the entire high-power LED component is limited in terms of size, photoelectric conversion Efficiency and thermal efficiency are limited
[0007] At present, the commonly used high-power LED components cover all the LED units with a layer of packaging material filled in the groove. The light source of the entire LED module is composed of different numbers of LED units, but the packaging material cannot be used. Each layer constitutes an exclusive optical mechanism for each LED unit, so the power performance of the entire LED module is still not as ideal as expected

Method used

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  • Light-emitting diode assembly and packaging method thereof
  • Light-emitting diode assembly and packaging method thereof
  • Light-emitting diode assembly and packaging method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0026] Such as figure 1 The flow chart of the packaging of light-emitting diode components of the present invention, figure 2 The top view of the structure of the light emitting diode assembly according to Embodiment 1 of the present invention, image 3 As shown in the cross-sectional view of the light emitting diode assembly structure of Embodiment 1 of the present invention, the packaging method of the light emitting diode assembly of the present invention includes the following steps:

[0027] a. Provide a carrier 10, the carrier 10 has a metal substrate 11, an insulating layer 12 and a copper foil layer 13 are successively provided on the plate surface of the metal substrate 11; the copper foil layer 13 is separated by at least two blocks 131 , the copper foil layer 13 and at least one external power contact 132 are respectively formed on two predetermined blocks 131 .

[0028] b. With at least one chip 21 as a light emitting unit 20, a predetermined number of chips 21 ...

Embodiment 2

[0037] The difference between this embodiment and Embodiment 1 is that each light emitting unit 20 is as Figure 4 As shown, at least one chip 21 of upper and lower electrode type (upper in the figure) and at least one chip 21 of planar electrode type (lower in the figure) are included, so that each light emitting unit 20 has better color rendering.

Embodiment 3

[0039] The difference between this embodiment and Embodiment 1 or 2 is that the chip 21 in the present invention is relatively deep into the predetermined depth under the carrier 10 board surface, such as Figure 5 As shown, the carrier 10 has a metal substrate 11, an insulating layer 12 and a copper foil layer 13 are arranged on the surface of the metal substrate 11 in turn, and at least one metal substrate 11 is exposed on the surface of the carrier 10. In the open area 14 , at least one chip 21 is fixed on the metal substrate 11 in the open area 14 .

[0040] The copper foil layer 13 is also divided into at least two blocks 13, and at least one external power contact 132 is respectively formed on the predetermined two blocks 131, and each chip 21 is respectively fixed on the metal substrate 11 in the open area 14. , and respectively fixed on the predetermined blocks 131 of the copper foil layer 13, and are directly or indirectly electrically connected 131 to the block to wh...

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Abstract

The invention discloses a light-emitting diode assembly and a packaging method thereof. The packaging method comprises the following steps: fixedly arranging chips with a scheduled number onto a carrier in the manner of taking at least one chip as one light-emitting unit; forming at least two light-emitting units on the board of the carrier; respectively enabling at least one packaging material cover to the positions of all light-emitting units; and respectively forming anticipative optical mechanisms on all the light-emitting units by all the packaging materials. Under the action of the packaging materials to which all the light-emitting units belong, the best brightness performance effect is generated by all the light-emitting units; and especially, under the segmentation action of different media of the packaging materials and the outside air, the chips of different light-emitting units are effectively prevented from absorbing light with each other, so that a better photoelectric conversion effect is obtained by the whole light-emitting diode assembly.

Description

technical field [0001] The present invention relates to a light-emitting diode component and its packaging technology, in particular to a light-emitting diode component with at least two light-emitting units and capable of individually forming an expected optical mechanism for each light-emitting unit, and its related packaging method for a light-emitting diode component . Background technique [0002] With the continuous advancement of science and technology, the photoelectric conversion efficiency of light emitting diodes (Light Emitting Diode, LED) has also been continuously improved and improved, and in recent years, it has been emerging in personal computers, network communications, transportation, energy, medical treatment, processing, testing, etc. Driven by demand, light-emitting diodes have gradually become one of the most widely used optoelectronic components. [0003] Because the light-emitting diode component is a cold light, it has the advantages of low power c...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L25/075H01L33/48H01L33/64
CPCH01L2224/48091H01L2224/49109
Inventor 陈元杰
Owner 普照光电科技股份有限公司
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