Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment

Abstract

A device for positioning and loading a silicon wafer in a chemical-mechanical polishing apparatus is provided. A base plate (203) thereof is connected to a loading guide ring (302) thereabove by a support rod (301). An expansion portion on the upper part of a lift drive mechanism (201) is fixedly connected with a wafer clamp (401) thereabove. The wafer clamp (401) is connected with a wafer guide ring (402) on its outer side. The loading guide ring (302) is provided thereon with a guide mechanism for docking a silicon wafer loading device and a guide mechanism for receiving a silicon wafer from the top. The lower part of the base plate (203) or the lift drive mechanism (201) is provided with an automatic displacement adjusting mechanism and an automatic reset mechanism. The device can position a silicon wafer accurately and transfer it into a carrier for processing.

Description

technical field [0001] The invention relates to the technical field of silicon wafer chemical mechanical polishing (CMP) equipment and a silicon wafer positioning and loading device. Background technique [0002] In the production of integrated circuits, most of the processes involve wafer positioning and loading. The effect of wafer positioning and loading has an important impact on wafer processing. Improper handling may cause wafers to be scrapped or manufactured. The performance of the device is poor, and the stability and reliability are poor. Therefore, the development of a high positioning accuracy and efficient wafer positioning and loading method is of great significance for both wafer processing and semiconductor device production. It is precisely because wafer positioning and loading is the most important and frequent step in the manufacture of semiconductor devices, and its efficiency will directly affect the yield, performance and reliability of the device, so ...

AI Technical Summary

Problems solved by technology

[0004] In the current chemical mechanical polishing equipment, the main feature of the silicon wafer loading device is to directly load the silicon wafer by means of vacuum adsorption or water suspension on the carrier. These methods also bring some disadvantages while realizing wafer loading, such as directly controlling the carrier. Vacuum adsorption of silicon wafers is very difficult, and the huge system is likely to break the silicon wafers; when loading silicon wafers with a relatively large diameter, multiple injectors must be used to suspend the silicon wafers in water at the same time. Difficulty with the water pressure of the device, and a lot of deionized water was wasted in the film loading process, which increased the cost

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