Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment

A loading device and chemical mechanical technology, which is applied in the field of silicon wafer chemical mechanical polishing equipment and silicon wafer positioning loading device, can solve the problems of vacuum adsorption of silicon wafers, waste of deionized water, silicon wafer crushing, etc., and achieve automatic loading , improve efficiency, and facilitate installation and adjustment

Active Publication Date: 2014-07-23
THE 45TH RES INST OF CETC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the current chemical mechanical polishing equipment, the main feature of the silicon wafer loading device is to directly load the silicon wafer by means of vacuum adsorption or water suspension on the carrier. These methods also bring some disadvantages while realizing wafer loading, such as directly controlling the carrier. Vacuum adsorption of silicon wafers is very difficult, and the huge system is likely to break the silicon wafers; when loading silicon wafers with a relatively large diameter, multiple injectors must be used to suspend the silicon wafers in water at the same time. Difficulty with the water pressure of the device, and a lot of deionized water was wasted in the film loading process, which increased the cost

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  • Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment
  • Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment
  • Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with a preferred embodiment of the present invention and accompanying drawings; obviously, the described embodiments are only some embodiments of the present invention, not all implementations Example: Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0030] see Figure 1 to Figure 7, the silicon wafer positioning and loading device used in chemical mechanical polishing equipment has a substrate 203, and the substrate 203 is connected to the upper loading guide ring 302 through a support rod 301; a silicon wafer is placed between the loading guide ring 302 and the substrate 203. space; the fixed part of the lifting drive mechanism 201 is installed on the base plate 203, and the telescop...

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Abstract

A device for positioning and loading a silicon wafer in a chemical-mechanical polishing apparatus is provided. A base plate (203) thereof is connected to a loading guide ring (302) thereabove by a support rod (301). An expansion portion on the upper part of a lift drive mechanism (201) is fixedly connected with a wafer clamp (401) thereabove. The wafer clamp (401) is connected with a wafer guide ring (402) on its outer side. The loading guide ring (302) is provided thereon with a guide mechanism for docking a silicon wafer loading device and a guide mechanism for receiving a silicon wafer from the top. The lower part of the base plate (203) or the lift drive mechanism (201) is provided with an automatic displacement adjusting mechanism and an automatic reset mechanism. The device can position a silicon wafer accurately and transfer it into a carrier for processing.

Description

technical field [0001] The invention relates to the technical field of silicon wafer chemical mechanical polishing (CMP) equipment and a silicon wafer positioning and loading device. Background technique [0002] In the production of integrated circuits, most of the processes involve wafer positioning and loading. The effect of wafer positioning and loading has an important impact on wafer processing. Improper handling may cause wafers to be scrapped or manufactured. The performance of the device is poor, and the stability and reliability are poor. Therefore, the development of a high positioning accuracy and efficient wafer positioning and loading method is of great significance for both wafer processing and semiconductor device production. It is precisely because wafer positioning and loading is the most important and frequent step in the manufacture of semiconductor devices, and its efficiency will directly affect the yield, performance and reliability of the device, so ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/27
CPCH01L21/68742H01L21/68785B24B37/345H01L21/68721
Inventor 高文泉陈波王伟李久芳
Owner THE 45TH RES INST OF CETC
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