Low emissivity glass containing silver
A low-emissivity glass and a manufacturing method technology, applied in the field of special glass, can solve the problems of appearance color showing interference color, reducing visible light transmittance, affecting the use of glass, etc.
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Embodiment 1
[0069] The film structure of the silver-containing low-emissivity glass embodiment 1 is as follows: glass, ZnSnO x , Ag, NiCrO x , ZnSnO x , Ag, NiCrO x , ZnSnO x , Ag, NiCrO x , ZnSnO x , Ag, NiCrO x , ZnSnO x 、Si 3 N 4 .
[0070] In this embodiment, the base dielectric combination layer is ZnSnO x layer with a thickness of 27 nm.
[0071] In this embodiment, the thickness of the first silver layer is 8nm.
[0072] In this embodiment, the first barrier layer is NiCrO x layer with a thickness of 0.3 nm.
[0073] In this embodiment, the first interlayer dielectric combination layer is ZnSnO x layer with a thickness of 69 nm.
[0074] In this embodiment, the thickness of the second silver layer is 12nm.
[0075] In this embodiment, the second barrier layer is NiCrO x layer with a thickness of 0.3 nm.
[0076] In this embodiment, the second interlayer dielectric combination layer is ZnSnO x layer with a thickness of 71 nm.
[0077] In this embodiment, the thic...
Embodiment 2
[0094] The film structure of another specific embodiment of the silver-containing low-emissivity glass is as follows: glass, Si 3 N 4 , Ag, NiCr, Si 3 N 4 , Ag, NiCr, Si 3 N 4 , Ag, NiCr, Si 3 N 4 , Ag, NiCr, Si 3 N 4 、TiO 2 .
[0095] In this embodiment, the base dielectric combination layer is Si 3 N 4 layer with a thickness of 25 nm.
[0096] In this embodiment, the thickness of the first silver layer is 7.6 nm.
[0097] In this embodiment, the first barrier layer is a NiCr layer with a thickness of 0.3 nm.
[0098] In this embodiment, the first interlayer dielectric combination layer is Si 3 N 4 layer with a thickness of 67 nm.
[0099] In this embodiment, the thickness of the second silver layer is 10.8nm.
[0100] In this embodiment, the second barrier layer is a NiCr layer with a thickness of 0.3 nm.
[0101] In this embodiment, the second interlayer dielectric combination layer is Si 3 N 4 layer with a thickness of 69 nm.
[0102] In this embodimen...
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