Coating processing method
A processing method and a technology to be processed are applied in sputtering plating, ion implantation plating, vacuum evaporation plating, etc., which can solve the problems of uneven pattern thickness, poor hardness and wear resistance, and blurred edges, and achieve Good physical properties, guaranteed uniform effect
Inactive Publication Date: 2012-03-14
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
However, since the mask covering the non-patterned area has a certain thickness, after coating the patterned area, the thickness of the mask causes some reactive particles to adhere, resulting in unclear edges of the pattern and uneven thickness of the entire pattern
The edge is not clear The edge is blurred under a high-power microscope, that is, the pattern accuracy is too low, especially when the shape of the surface to be plated is complex, it is more difficult to form a high-precision pattern
Uneven pattern thickness will cause poor physical properties of the pattern, such as poor hardness and wear resistance
Method used
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Embodiment Construction
[0022] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0023] see figure 1 and figure 2 , the coating processing method provided by the embodiment of the present invention at least includes the following steps:
[0024] First, a workpiece 10 is provided, and the workpiece 10 has a first surface 101 to be processed to form a pattern. The workpiece 10 is made of metals or alloys that can be attracted by magnetic substances, specifically, the workpiece 10 can be made of metals, such as iron and nickel; or made of alloys containing metals, such as stainless steel.
[0025] Then, a mask 30 having the same shape as the pattern to be formed is provided. The mask is magnetically attracted to the workpiece. For example, the mask 30 has strong magnetism, and the workpiece 10 is made of metal or alloy that can be attracted by magnetic substances. The mask 30 is adsorbed on the first surface 101 and covers a predetermi...
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The invention discloses a coating processing method, comprising the following steps: providing a workpiece which has a first surface to be processed to form a pattern; providing a mask which has a same shape with the pattern to be formed and can be attractive to the workpiece by magnetic property; absorbing the mask on the first surface and letting the mask cover the predetermined area of the first surface; coating a shielding layer on the area of the first surface outside of the predetermined area; removing the mask; depositing a film on the first surface with physical vaporous deposition for covering the shielding layer and the predetermined area; covering the film of the predetermined area with the mask; removing the film of the area outside of the predetermined area and the shielding layer; and removing the mask to obtain the pattern on the first surface.
Description
technical field [0001] The invention relates to coating processing, in particular to a method for processing the coated film layer on the surface of a workpiece to form a predetermined pattern. Background technique [0002] In the traditional coating technology field, the method of processing the surface of a workpiece to form a pattern is usually to cover up the predetermined pattern area, and then directly coat the predetermined pattern area. However, since the mask covering the non-pattern area has a certain thickness, after coating the pattern area, the thickness of the mask causes some reactive particles to adhere, resulting in unclear edges of the pattern and uneven thickness of the entire pattern. Unclear edges appear as fuzzy edges under a high-power microscope, that is, the pattern accuracy is too low, especially when the surface to be plated has a complex shape, it is more difficult to form a high-precision pattern. The uneven thickness of the pattern will cause p...
Claims
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IPC IPC(8): C23C14/04
Inventor 王仲培
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD