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semiconductor package

A semiconductor and packaging technology, applied in the field of semiconductor packaging, can solve problems such as unreliability and data instability, and achieve the effect of reducing the total thickness and volume

Active Publication Date: 2015-11-25
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although various methods have been proposed to improve the integration and data processing capabilities of semiconductor devices used in such electronic devices, these methods face several problems and disadvantages, such as data instability and unreliability in semiconductor devices

Method used

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Embodiment Construction

[0027] A semiconductor package and a lead frame according to embodiments of the inventive concept will now be described more fully with reference to the accompanying drawings, in which example embodiments of the inventive concept are shown. However, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the inventive concept as defined by the claims. Since the inventive concept allows various changes and various embodiments, specific embodiments will be shown in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to a specific implementation mode, and it should be understood that all changes, equivalents and replacements that do not depart from the spirit and technical scope of the present invention are included in the present invention.

[0028] It will be understood that when an element or layer is re...

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Abstract

A semiconductor package may include a package substrate having a first surface and a boundary that may be defined by edges of the package substrate. The package further includes a first semiconductor chip having a front surface and a back surface. The back surface of a first portion of the first semiconductor chip may be disposed on the first surface of the package substrate with the back surface of a second portion of the first semiconductor chip extending beyond of the defined boundary of the package substrate. The semiconductor package may also include a second semiconductor chip disposed on the back surface of the second portion of the first semiconductor chip that extends beyond the defined boundary of the package substrate.

Description

[0001] This application claims Korean Patent Application No. 10-2010-0077815 filed with the Korean Intellectual Property Office on August 12, 2010 and U.S. Patent Application No. 13 / 072,746 filed with the United States Patent and Trademark Office on March 27, 2011 rights, the disclosures of these applications are hereby incorporated by reference in their entirety. technical field [0002] The inventive concept generally relates to a semiconductor package substrate and a semiconductor package having the same. Background technique [0003] Nowadays, the demand for electronic devices having both a smaller size and a stronger data processing capability has been increasing. Although various methods have been proposed to improve the integration and data processing capabilities of semiconductor devices used in such electronic devices, these methods face several problems and disadvantages, such as data instability and unreliability in semiconductor devices. Contents of the inventi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L25/00
CPCH01L23/49503H01L23/13H01L23/49541H01L23/49816H01L24/48H01L24/73H01L2224/16145H01L2224/16225H01L2224/16227H01L2224/32145H01L2224/32245H01L2224/48145H01L2224/48227H01L2224/48245H01L2224/48247H01L2224/73253H01L2224/73257H01L2224/73265H01L2224/92247H01L2225/06562H01L2225/1029H01L2924/01087H01L2924/09701H01L2924/15151H01L2924/15311H01L2924/181H01L2924/19107H01L2924/00014H01L2924/00012H01L2924/00H01L2224/45099H01L2224/45015H01L2924/207
Inventor 张元基朴泰成
Owner SAMSUNG ELECTRONICS CO LTD
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