Unlock instant, AI-driven research and patent intelligence for your innovation.

Light-emitting diode package

A technology of light-emitting diodes and packages, applied in the direction of circuit heating devices, printed circuits, electrical components, etc., can solve problems such as hindering heat flow, low thermal conductivity, etc., to increase costs, prevent heat flow bottlenecks, maximize heat The effect of the release effect

Inactive Publication Date: 2012-03-21
金江
View PDF9 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, however, thermal grease has a low thermal conductivity of about 2 to 3 W / mK, which hinders heat flow

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-emitting diode package
  • Light-emitting diode package
  • Light-emitting diode package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] In the LED package according to one embodiment of the present invention, the entire bottom of the package body of the LED package is covered with solderable metal, and the bottom of the LED package is directly soldered to an inexpensive metal plate (or heat sink) to And metal plate to release the heat generated from the LED chip, thus increasing the heat release efficiency. Here, an inexpensive metal plate (or heat sink) includes only metal and does not include a resin layer. A copper or aluminum plate whose surface is plated with nickel to allow soldering can be used as the metal plate (heat sink). The solder metal may include 96.5% tin (Sn), 3% silver (Ag), and 0.5% copper (Cu).

[0046] According to another embodiment of the present invention, the LED package is bonded to an inexpensive metal plate that does not include a resin layer, using an adhesive (or bonding member, etc.), such as Ag epoxy resin with a thermal conductivity of about 3 W / mK, etc. . The Ag epox...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention relates to a light-emitting diode package, comprising: a package body including LEDs; a bottom heat transfer metal layer formed at the bottom surface of the package body; and a metal plate bonded to the bottom heat transfer metal layer. The bottom heat transfer metal layer is bonded to the metal plate by soldering or by an Ag epoxy adhesive, and the metal plate contains only metal without a resin layer.

Description

technical field [0001] The present invention relates to a light emitting diode package having an improved heat dissipation path by directly connecting the light emitting diode package to a metal plate. Background technique [0002] Light emitting diodes (LEDs) are two-terminal diode elements that include compound semiconductor materials such as GaAs, AlGaAs, GaN, InGaN, AlGaInP, and the like. When electric power is applied to the cathode terminal and the anode terminal, the LED emits visible light having light energy generated according to the recombination of electrons and holes. [0003] A white LED emitting white light may be realized by combining three colors of a red LED, a green LED, and a blue LED, or combining a phosphor with a blue LED. The emergence of white LEDs extends the application of LEDs from indicators of electronic products to daily products, advertising panels, etc. Recently, due to the high efficiency of LED chips, they are used to replace general light...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L23/36
CPCH01L2924/19107H01L33/486H01L33/62H05K1/0203H05K3/0061H05K2201/10106H01L2224/48091H01L2224/48227H01L33/641H01L2224/45144H01L2924/00014H01L2924/00
Inventor 金江
Owner 金江