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High frequency cantilever type probe clamp

A technology of probe cards and probes, which is applied in the direction of instruments, measuring devices, measuring electricity, etc.

Inactive Publication Date: 2014-03-19
MPI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the structure of the above-mentioned probe 20 makes the application range of the probe card more extensive, but in this era of rapid technological development, whoever can master more sophisticated technology will be the winner

Method used

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  • High frequency cantilever type probe clamp
  • High frequency cantilever type probe clamp
  • High frequency cantilever type probe clamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] In order to explain the present invention more clearly, a detailed description of preferred embodiments and illustrations are given below. among them, Figure 4 to Figure 6 Shown is a high-frequency cantilever probe card 100 according to a preferred embodiment of the present invention. Figure 5 for Figure 4 Sectional view of the 5-5 direction. and Image 6 It is a schematic diagram of the arrangement of signal pins and ground pins of a probe card. The probe card 100 can be used for electrical testing of signal connection structures of objects under test such as semiconductor dies, integrated circuits or other electronic circuit signal bearing substrates. It includes a The circuit board 30, a pin base 40, a plurality of signal pins 50, at least one ground pin 60 and a plurality of metal wires 70, wherein:

[0045] The circuit board 30 is a disc-shaped printed circuit board, which has an upper surface 30a and a lower surface 30b. The upper surface 30a is for electrical co...

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PUM

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Abstract

The invention discloses a high frequency cantilever type probe clamp which comprises a circuit board, an insulation needle seat, a plurality of signal needles and at least one grounding needle, wherein the signal needles and the grounding needle are fixedly connected with the insulation needle seat and are respectively and electrically connected with a signal circuit and a grounding circuit of the circuit board; each signal needle is provided with a probe body and an electricity conduction film; and the electricity conduction films cover the probe bodies in an electricity insulation manner along the axial direction of the probe bodies, thereby reducing the capacitance coupling area and the thickness of insulation materials between the probe bodies and the electricity conduction films, so that the radial section areas of the signal needles can be reduced, and the signal needles can be facilitated to be more densely arranged.

Description

Technical field [0001] The invention relates to a probe device for electrical detection, and more specifically to a high-frequency cantilever probe card. Background technique [0002] figure 1 , figure 2 The shown high-frequency cantilever probe card 10 is used to transmit the test signal of a testing machine to an electronic component for electrical testing. figure 2 for figure 1 2-2 direction cross-sectional view. The probe card 10 includes a circuit board 12, a probe holder 14 and a plurality of coaxial probes 16. The circuit board 12 is provided with a plurality of coaxial wires 12a which are electrically connected to the coaxial probes 16. The needle 16 is composed of a probe body 16a, an insulating layer 16b and a conductive shaft tube 16c. The probe body 16a is used for high-frequency signal transmission, and the conductive shaft tube 16c is electrically connected to the ground potential. The probe 16 has good and effective high frequency signal transmission performance...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/067G01R31/00
Inventor 顾伟正何志浩赖俊良谢昭平张启钊
Owner MPI CORP