Multi-power-supply circuit board and probe clamp applied to same

Abstract

The invention discloses a multi-power-supply circuit board and a probe clamp applied to the multi-power-supply circuit board. The multi-power-supply circuit board and the probe clamp applied to the multi-power-supply circuit board comprise a plurality of power supply probes arranged on the multi-power-supply circuit board; the multi-power-supply circuit board is provided with a circuit substrate and a power supply distribution module; the circuit substrate is provided with a plurality of first power supply circuits which are respectively used for transmitting power supply signals of different potentials; each first power supply circuit is arranged on periphery of the circuit substrate extending inwards; each power supply distribution module is provided with a plurality of second power supply circuits which are respectively used for communicating power supply signals transmitted by the first power supply circuits with at least one of the power source probes in an equipotential manner; and the quantity of the power supply probes is greater than that of the first power supply circuits.

Description

technical field [0001] The invention relates to an elastic contact device used in semiconductor testing, in particular to a multi-power circuit board and its application probe card. Background technique [0002] The main purpose of the probe card is to receive the test signal output by the electrical testing machine, so that the test signal can be transmitted to the probe through the circuit board of the probe card and the probe to perform circuit space conversion, and then to the test of only a fine pitch on the chip pads for automated wafer-level testing. With the increasing complexity of integrated circuits, a single chip can cover circuit components with multiple functions, so the demand for multiple power supplies corresponding to different voltage levels for different circuit components also increases; please refer to Figure 5 As shown, when the multi-power supply chip 4 of the integrated circuit chip is electrically tested, the multiple power supply circuits 5a, 5b, ...

AI Technical Summary

Problems solved by technology

However, since the jumper wire structure has a considerable wire diameter, even if the distance between the adjacently arranged wires is still far greater than the distance between the circuit elements to be tested; therefore, even if the wire 6b is jumpered to the top of the probe solder joint and electrically connected to it, each probe After 6d is soldered to the circuit board 6a, most of the turning points need to have an appropriate angle to align the tip of the needle with the circuit component to be tested, so once faced with high current density test conditions, the turning point of the probe is likely to produce the effect of high current electric field concentration , thereby causing electrical interference to adjacent test signals and affecting their transmission characteristics

[0004] However, if all the power signals are arranged inside the circuit board of the probe card, and a specific circuit layout is made by multi-layer circuit printing technology, because the layout conditions of the power circuit are completely different from the transmission requirements of small signals or high-frequency signals, as long as A chip has its specific multi-power supply circuit layout, and the probe card manufacturer needs to produce a completely corresponding test board for the individual chip process; and as long as the circuit layout of the prepared electronic components is changed, each power supply signal in the chip circuit The transmission path of the probe card has changed, and the probe card manufacturer still has to redesign and manufacture the test circuit board corresponding to its circuit layout. For this reason, the probe card manufacturer must spend considerable man-hours and production costs, especially when preparing integrated circuits. When the complexity and the more circuits to be tested, the relative production of special boards will take more man-hours and costs

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