Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor integrated circuit and method of controlling memory device

A technology of integrated circuits and semiconductors, applied in the priority field of Japanese patent applications, to achieve the effect of suppressing manufacturing costs

Active Publication Date: 2015-02-25
KK TOSHIBA
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If two types of nonvolatile memory are mounted in this way, each control circuit is required in addition to the two types of nonvolatile memory, and the manufacturing cost of the IC increases, and there is a problem of increasing the size of the IC.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor integrated circuit and method of controlling memory device
  • Semiconductor integrated circuit and method of controlling memory device
  • Semiconductor integrated circuit and method of controlling memory device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] According to one embodiment, a semiconductor integrated circuit device includes a non-volatile memory, a storage unit, and an arithmetic unit. The nonvolatile memory has first and second areas. The storage unit stores a second program for downloading the first program from the outside to the first area. The arithmetic unit executes the first and second programs described above. The first area can be written and erased by the first program, and the second area cannot be erased by the first program.

[0024] Hereinafter, embodiments of the semiconductor integrated circuit device and memory management method will be described in detail with reference to the drawings.

[0025] figure 1 It is a schematic block diagram of a semiconductor integrated circuit device 100 according to an embodiment. The semiconductor integrated circuit device 100 in the figure is, for example, an IC mounted on a mobile phone.

[0026] The semiconductor integrated circuit device 100 includes a power ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

According to one embodiment, a semiconductor integrated circuit device includes a non-volatile memory, a storing module, and a processing module. The non-volatile memory is having a first area and a second area. The storing module is configured to store a second program for downloading a first program from an outside to the first area. The processing module is configured to execute the first and the second programs. The non-volatile memory is having a first area and a second area. The storing module is configured to store a second program for downloading a first program from an outside to the first area. The processing module is configured to execute the first and the second programs. The first area is capable of being written and erased by the first program, and the second area is not capable of being erased by the first program.

Description

[0001] This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2010-211922 filed September 22, 2010, the entire contents of which are incorporated herein by reference. technical field [0002] Embodiments relate to a semiconductor integrated circuit device and a memory management method. Background technique [0003] A SIM (Subscriber Identity Module, Subscriber Identity Module) card is a type of IC (Integrated Circuit) used in mobile phones and the like. On the SIM card, for example, EEPROM (Electrically Erasable Programmable ROM) and OTP (One Time Programmable ROM) are mounted. The EEPROM is used as a nonvolatile memory capable of writing and erasing data. In addition, OTP can be used as a write-once non-volatile memory. If two types of nonvolatile memories are mounted in this way, separate control circuits are required in addition to the two types of nonvolatile memories, which increases the manufacturing cost of the IC,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G11C16/06
CPCG11C16/22G11C16/06G11C16/14
Inventor 中野宽生
Owner KK TOSHIBA