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Manufacturing method of heat radiation device

A manufacturing method and heat dissipation device technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of small heat source contact area, inability to absorb heat, complicated manufacturing process of heat dissipation device, etc., and achieve the effect of easy ductility

Active Publication Date: 2015-06-17
HUIZHOU XUNSHUO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the end faces of heat dissipation heat pipes used in computer heat dissipation or other electronic component heat dissipation are arc-shaped or cone-shaped. The disadvantage is that the arc-shaped or tapered end faces contact the heat source vertically. , can not absorb heat better, and the manufacturing process of the existing heat sink is complicated, and the production cost is high

Method used

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  • Manufacturing method of heat radiation device
  • Manufacturing method of heat radiation device
  • Manufacturing method of heat radiation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Example 1, see Figure 1-4 , the heat dissipation device includes a heat dissipation press plate 1 and a metal heat pipe 2, the bottom of the heat dissipation press plate 1 has an open slot 3, and the pressing part 4 of the metal heat pipe 2 is pressed into the open slot 3. The pressing part 4 of the metal heat pipe 2 of this embodiment is completely press-fitted in the opening slot 3 and forms a plane with the bottom of the heat dissipation pressing plate 1 . The pressing part is a certain position of the metal heat pipe, including the middle position of the metal heat pipe and the end of the metal heat pipe. The pressing part of this embodiment is the middle position of the metal heat pipe.

[0021] See image 3 , 4 , the pressing part 4 of the metal heat pipe 2 is completely installed in the opening slot 3, the pressing part 4 of the metal heat pipe 2 forms a plane with the bottom of the heat dissipation plate 1, and there is no gap between them, and the pressing ...

Embodiment 2

[0023] Example 2, see Figure 5 The difference between this embodiment and Embodiment 1 is that the heat dissipation platen 1 and the opening slot 3 have different shapes.

Embodiment 3

[0024] Example 3, see Figure 6 , The difference between this embodiment and Embodiment 1 is that the shape of the heat dissipation platen 1 is different.

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Abstract

The invention discloses a manufacturing method of a heat radiation device. The method comprises the following steps that: a heat radiation press plate is provided, wherein the bottom of the press plate is a plane, and at least one opening trench is provided at the bottom of the heat radiation press plate; stitching portions of metal heat tubes are closely fit with and stitched in the opening trench, so that a state that the plane or the stitching portions of the metal heat tubes are protruded outside the bottom of the heat radiation press plate is formed at the stitching portions of the metal heat tubes and the bottom of the heat radiation press plate; and no-clearance connection is formed between the metal heat tubes and the opening trench. According to the invention, high efficient thermal conductivity of heat tubes is utilized and the heat tubes can be directly contacted to an electronic component in a large are, wherein the electronic component needs to carry out heat radiation; and the heat tubes directly absorb heat emitted by the electronic component and efficiently introduce the heat into a heat radiation end for heat radiation. Therefore, the method has advantages of good heat radiation effect, simple manufacture and reduction of production cost.

Description

technical field [0001] The invention relates to a manufacturing method of a cooling device for electronic components. Background technique [0002] Since electronic components generate heat when they consume electricity, the longer an electronic component is used, the more heat it will generate. Electronic components have their normal working temperature range, if the temperature of the electronic components themselves exceeds this working temperature range, the operation results of the electronic components may be wrong. Therefore, it is very important to adopt a good heat dissipation structure for electronic components. A heat pipe, also known as a heat pipe or a superconductor, is a component that improves heat transfer efficiency. From a thermodynamic point of view, the heat absorption and heat release of objects are relative. As long as there is a temperature difference, the phenomenon of heat transfer from high temperature to low temperature will inevitably occur. W...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 曾道平
Owner HUIZHOU XUNSHUO TECH CO LTD