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Cooling device of electronic equipment and electronic equipment

A heat dissipation device and technology for electronic equipment, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of inability to improve the heat dissipation performance of the radiator, time-consuming, thickening of the chassis, etc., to achieve improved heat dissipation, reduced noise and power consumption, Effect of suppressing temperature rise

Active Publication Date: 2015-03-04
LENOVO (SINGAPORE) PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The method of Patent Document 1 is effective for suppressing the temperature rise of the chassis, but it cannot improve the heat dissipation performance of the radiator
In addition, the method of Patent Document 1 installs the intake port at a predetermined position near the radiator, so it may take time and effort to adjust the overall air balance.
In addition, an air flow path is formed between the metal plate and the bottom surface of the case, so the case becomes thicker accordingly

Method used

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  • Cooling device of electronic equipment and electronic equipment
  • Cooling device of electronic equipment and electronic equipment
  • Cooling device of electronic equipment and electronic equipment

Examples

Experimental program
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Embodiment Construction

[0037] figure 1 (A) and figure 1 (B) is a perspective view of the notebook PC according to the embodiment of the present invention viewed from the front and the rear. The notebook PC 10 is in a state where a display case 11 holding a liquid crystal display device (LCD) 12 is opened from a system case 15 . A large number of electronic devices such as a central processing unit (CPU), a graphics processing unit (GPU), a main memory, and a hard disk drive (HDD) are accommodated inside the system chassis 15 . The temperature of these electronic components rises during the working process and becomes a heat source, which causes the temperature inside the system chassis 15 to rise.

[0038] On the surface of the system case 15 , a keyboard 20 is arranged surrounded by a palm rest 21 and a keyboard frame 14 . In addition, an optical disk drive (ODD) 13 is mounted on a side surface of the system case 15, and exhaust ports 16, 17 and air intake ports 18, 19 are formed. Inside the sy...

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PUM

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Abstract

PROBLEM TO BE SOLVED: To provide an efficient heat radiator.SOLUTION: A centrifugal type fan 101 is housed in an air chamber 110. A heat sink 107 is placed near the centrifugal type fan 101, and multiple radiation fins are connected to heat absorption surfaces 107a and 107b to form multiple air passages. A slit conductive path 157 extends in a direction perpendicular to surfaces of the multiple radiation fins. Air pressurized by the centrifugal type fan is exhausted from an exhaust port 16 via spaces between multiple radiation fins and each conductive path.

Description

technical field [0001] The present invention relates to a high-efficiency heat sink used in electronic equipment, and more specifically, to a heat sink capable of suppressing an increase in the temperature of a case of the electronic equipment. Background technique [0002] For portable electronic devices such as notebook personal computers (hereinafter referred to as notebook PCs), the performance of electronic components such as processors and video chips has improved in recent years, or the mounting density of housings has increased, resulting in increasing heat generation. In order to maintain the functions of the electronic components accommodated inside the case, the temperature during operation must not exceed an allowable value. Furthermore, since the notebook PC is handled by hand or on the lap, it is necessary to suppress the temperature rise of the chassis. [0003] For this purpose, a cooling device consisting of a radiator, a cooling pipe, and a cooling fan is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 上村拓郎田角和也安达贵光
Owner LENOVO (SINGAPORE) PTE LTD