Heat sink for a protrusion-type ic package

Abstract

The present invention relates to a heat dissipation plate for a projection-type integration circuit (IC) package, which is installed to be adhered and fixed to a projection-type IC package in which an integration circuit in a board is formed to project, so as to dissipate heat generated by the integrated circuit, including: a fixed plate adhered and fixed to the projection-type IC package; and heat dissipation fins (cooling fins) formed to be inclined upward from both opposing sides of the fixed plate, wherein an accommodation groove that accommodates the integrated circuit is formed in a rear surface of the fixed plate, and the accommodation groove is formed to have a shape to be joined to the integrated circuit, and the integrated circuit comes into close contact with the accommodation groove. Therefore, there are advantages in that the heat dissipation plate can enhance not only heat dissipation efficiency but also adhesion performance by increasing the contact area with the projection-type IC package, and simultaneously can be simply produced, thereby reducing production costs.

Description

technical field [0001] The present disclosure relates to a heat dissipation plate for a protrusion type IC package in which an integrated circuit (IC) in a substrate is formed as a protrusion, and more particularly, the present disclosure relates to a heat dissipation plate for a protrusion type IC package as follows Board: It is mounted to be bonded and fixed to the bump type IC package and effectively dissipates the heat generated by the integrated circuit. Background technique [0002] Integrated circuit (IC) packages introduced in order to meet technical demands in accordance with the trend of increasing the number of pins have solder balls fused to the surface of the IC package, or use a large number of leads provided on the side surface of the IC package as inputs and Output devices, whereby the package provides a large number of input and output signals and is formed in a small size. [0003] figure 1 A protrusion type IC package 1 among various types of IC packages...

AI Technical Summary

Problems solved by technology

[0007] However, as the heat dissipation plate according to the related art used in the protrusion type IC package, actually used such as figure 2 (a) and figure 2 Typical heat sink H shown in (b), therefore cannot effectively dissipate heat from the protruding IC package

That is, in such figure 2 (a) and figure 2 In the case where the heat dissipation plate H according to the related art in (b) is mounted on the protrusion type IC package, since the integrated circuit mounted on the protrusion type IC package is formed to protrude from the substrate, while the fixing plate P of the heat dissipation plate The rear surface is formed as a flat surface, so the contact area is limited to the top of the integrated circuit, so there is a problem that the heat dissipation performance is not high and the adhesion performance of the heat dissipation plate is reduced

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