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Light emitting diode packaging structure and packaging method thereof

A technology of light-emitting diodes and packaging structures, which is applied in the direction of electrical components, electrical solid-state devices, circuits, etc., and can solve problems such as broken connecting wires and reduced yield of packaged products

Inactive Publication Date: 2012-05-16
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the stress generated is large, the connecting wire may be broken, thereby reducing the yield of packaged products

Method used

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  • Light emitting diode packaging structure and packaging method thereof
  • Light emitting diode packaging structure and packaging method thereof
  • Light emitting diode packaging structure and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] Such as figure 1 As shown, the LED packaging structure 100 according to the first embodiment of the present invention includes a substrate 10 , LED die 20 and connecting wires 30 disposed on the substrate 10 .

[0036] The substrate 10 may be an aluminum-based circuit board or a ceramic substrate provided with conductive lines on the surface, such as an alumina substrate, a zinc oxide substrate, or a silicon substrate. The surface of the substrate 10 is provided with a first electrical connection portion 110 and a second electrical connection portion 120 . The first electrical connection part 110 and the second electrical connection part 120 are insulated from each other. In this embodiment, the first electrical connection portion 110 and the second electrical connection portion 120 extend from the upper surface to the lower surface of the substrate 10 , thereby forming a surface mountable structure.

[0037] The LED die 20 is disposed on the surface of the first elec...

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Abstract

The invention provides a light emitting diode packaging structure which comprises a substrate, a first electric connection unit and a second electric connection unit which are provided on the substrate, and a light emitting diode crystal grain provided on the first electric connection unit. The first electric connection unit and the second electric connection part have electrical insulating property. The light emitting diode crystal grain comprises a first electrode and a second electrode, the first electrode is electrically connected with the first electric connection unit, and the second electrode is electrically connected with the second electric connection unit through a connecting line. The connecting line comprises a first bending part close to the second electrode and a second bending part far from the second electrode. A center of a circle of curvature where the first bending part is and a center of a circle of curvature where the second bending part is are at two opposite sides of the connecting line respectively. According to a shape of the connecting line, stress in a wiring process can be effectively buffered, thus broken of the connecting line is avoided. The invention also provides a packaging method of the light emitting diode.

Description

technical field [0001] The invention relates to a packaging structure of a light emitting diode, in particular to a packaging structure of a light emitting diode capable of preventing metal wires from being broken during the wire bonding process and a corresponding packaging method of the light emitting diode. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a semiconductor element that can convert electric current into light in a specific wavelength range. Light-emitting diodes can be widely used as light sources in the field of lighting because of their advantages such as high brightness, low operating voltage, low power consumption, easy matching with integrated circuits, simple driving, and long life. [0003] In the existing LED packaging structure, generally a connecting wire is required to electrically connect the LED die and the lead frame, and this process is generally called wire bonding. During the wire bonding process, one end ...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62H01L33/00
CPCH01L24/48H01L2224/48H01L2224/4809H01L2224/48472H01L2224/49107H01L2224/73265H01L2924/12041H01L2924/14H01L2924/15787H01L2924/181H01L2924/00H01L2924/00012
Inventor 杨家强简克伟
Owner ZHANJING TECH SHENZHEN
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