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Heat sink and electronic device using the same

A heat dissipation device and electronic device technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of user discomfort, increase in the size of electronic devices, high surface temperature, etc., and achieve the effect of cost saving and temperature improvement

Inactive Publication Date: 2015-10-07
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in actual use, the surface temperature of the casing below the cooling fin group is often relatively high, so that the user's discomfort will be caused due to the overheating of the casing.
If other heat dissipation devices are added in the electronic device to specifically dissipate heat from the overheated casing, the size of the electronic device will be increased, which is not conducive to the development of the electronic device in the direction of shortness, lightness and thinness

Method used

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  • Heat sink and electronic device using the same
  • Heat sink and electronic device using the same
  • Heat sink and electronic device using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] see Figure 1 to Figure 2 , which shows an electronic device 100 according to a preferred embodiment of the present invention. The electronic device 100 includes a casing 30 , a circuit board 20 fixed on the casing 30 and a heat sink 10 accommodated in the casing 30 .

[0054] A central processing unit 21 is pasted on the circuit board 20 , and four through holes 22 are respectively provided at four corners of the central processing unit 21 on the circuit board 20 . The casing 30 is provided with corresponding through holes (not shown) corresponding to the through holes 22 . The casing 30 also defines three through holes 31 at intervals on one side of the circuit board 20 .

[0055] The cooling device 10 includes a heat pipe 11 , a centrifugal fan 12 , a cooling fin set 13 disposed on one side of the centrifugal fan 12 , and a fixing bracket 14 for fixing one end of the heat pipe 11 to the CPU 21 .

[0056] The heat pipe 11 is roughly flat and L-shaped, and includes ...

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Abstract

The invention discloses a heat radiator, which comprises a heat radiating fin group, a heat tube in hot contact with a heating electronic element and a centrifugal fan, wherein the centrifugal fan is provided with an air outlet; the heat radiating fin group is arranged at the air outlet of the centrifugal fan; the heat tube comprises an evaporation section and a condensation section extending from the evaporation section; the heat radiating fin group is contacted with the condensation section of the heat tube; the evaporation section is used for being in hot contact with the heating electronic element; and the height of the air outlet of the centrifugal fan is greater than that of the heat radiating fin group, so that one part of air current flowing out of the air outlet flows to an interval between the air outlet and the heat radiating fin group. The invention also relates to an electronic device using the heat radiator.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device capable of cooling a casing and an electronic device using the heat dissipation device. Background technique [0002] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components in electronic devices are also increasing, resulting in more and more heat and higher temperatures generated by electronic components, seriously affecting the performance of electronic devices. In order to ensure the normal operation of electronic devices, the heat generated by these electronic components must be dissipated in a timely manner. For this reason, heat sinks are widely used in various electronic devices. [0003] A commonly used heat dissipation device generally includes a heat dissipation fin set and a fan. The heat dissipation fin set is attached to a heat generating electronic component and is loca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/467
Inventor 陈荣安赵健佑
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD