Manufacture procedure of LED (light emitting diode) lamp module

Abstract

The invention relates to a manufacture procedure of an LED (light emitting diode) lamp module. According to the manufacture procedure, a thermally conductive adhesive is coated to the bottom of a circuit substrate, and the circuit substrate and a heat radiating fin are subjected to thermocuring combination, so that the circuit substrate and the heat radiating fin are first formed into a heat radiating module; solder paste is printed on electroplating contacts on the surface of the circuit substrate of the heat radiating module, pins of an LED, electronic parts, an IC (integrated circuit) and the like are arranged on the electroplating contacts on which the solder paste is printed, and the solder paste of the circuit substrate is molten once again in a reflow oven, so that the LED is soldered on the circuit substrate; and the circuit substrate is cooled to cure the solder paste. Therefore, the circuit substrate and the heat radiating fin are first subjected to thermocuring combination, the LED is effectively prevented from being damaged due to secondary thermal treatment, so that the probability of light decay and damage of the LED is reduced.

Description

technical field [0001] The invention provides a manufacturing process of an LED lamp module, especially a lamp manufacturing process that can reduce the LED damage rate and improve the weather resistance of the LED lamp. Background technique [0002] Because LEDs have the advantages of small size, power saving, shock resistance, fast response, long life, etc., LEDs have been widely used in screen displays or lighting devices as light sources for display and lighting. For example, the application of LED can be seen in the backlight of liquid crystal display, the backlight and button light source of mobile phone, as well as the lamp and instrument panel of automobile, etc. [0003] The manufacturing process of conventional LED lamps includes the following steps: First, use a solder paste printing machine to print solder paste on the electroplated contacts (or jacks) on the surface of the circuit board; then, paste the LED, electronic parts and IC pins On or inserted into the ...

AI Technical Summary

Problems solved by technology

[0004] Conventional LEDs and circuit substrates can be electrically connected by placing LEDs on the circuit substrate through the above-mentioned process, and at the same time, the circuit substrate can be combined with the heat sink. However, such a combination is not sufficient in terms of tightness and strength. , especially in an environment with drastic changes in temperature, separation may occur and the heat added to the circuit substrate by the LED cannot be dissipated or reduced through the heat sink

Therefore, the industry implements the thermally conductive adhesive with a more compact thermosetting thermally conductive adhesive. When using a thermosetting thermally conductive adhesive as the connection medium, the LED, circuit board and heat sink must be subjected to a second long-term at the same time. Time (tens of minutes) high temperature (up to 150 ℃) baking, to make thermosetting heat-conductive adhesive curing stereotypes, such a long time (tens of minutes) high temperature (up to 150 ℃) baking, will undoubtedly The LED will be prone to light decay and damage due to high temperature

[0005] In view of the conventional way of combining LEDs and circuit boards, first soldering and then bonding, and the secondary high temperature required for curing and shaping of the thermosetting heat-conducting adhesive will cause LEDs to have light decay and loss of damage. Therefore, how to develop a LED lighting module manufacturing process that can reduce the LED damage rate is an urgent problem for LED lighting manufacturers to overcome.

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