An AC LED lighting device

Abstract

An LED light emitting unit comprises an LED chip (2) and a light-emitting material (1) emitting light excited by the LED chip (2). The usage life of the light-emitting material is 1-100 milliseconds; the LED chip (2) is a single PN node LED chip; the LED light emitting unit is driven by an alternating-current with a frequency not lager than 100 Hz. An alternating current-driven LED light emitting device comprises the LED light emitting unit. The LED light emitting device avoids using an alternating current-driven LED chip integrated by multiple micro crystal grains, thus realizing a modest fluctuation of the brightness in the alternating-current period, simple production, and low cost, and solving the stroboscopic problem caused by the alternating-current power supply and the heat radiating problem caused by micro chip integration.

Description

Technical field [0001] The invention relates to an AC LED lighting device, belonging to the technical field of AC LED lighting device manufacturing. Background technique [0002] At present, LEDs are used in fields such as lighting, display, and backlight sources, and have attracted widespread attention as the most promising next-generation lighting method for their energy-saving, durable, and pollution-free advantages. Traditional LED chips use direct current as the driving current. However, at present, whether it is household, industrial, commercial or public electricity, most of it is provided in the form of power frequency alternating current. Therefore, when using LEDs for lighting and other purposes, a rectifier transformer must be attached to convert AC to DC. In order to ensure the normal operation of the LED. However, in the process of AC-DC conversion, there is a power loss of up to 15-30%. At the same time, the conversion device not only has a short service life, but ...

AI Technical Summary

Problems solved by technology

However, the processing of this kind of AC LED chip is difficult, and the integration of a huge number of microchips in a small substrate space will lead to problems such as poor heat dissipation.

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