Double side polishing apparatus and carrier therefor

A double-sided polishing and bracket technology, which is applied in the direction of grinding devices, electrical components, circuits, etc., can solve limitations and other problems, and achieve the effects of reducing processing costs, improving productivity, high flatness and stability

Active Publication Date: 2012-05-23
LG SILTRON
View PDF5 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, brackets made of SUS DLC have limitations in thickness control, and thus have limitations in ensuring flatness with stable quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Double side polishing apparatus and carrier therefor
  • Double side polishing apparatus and carrier therefor
  • Double side polishing apparatus and carrier therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. Before proceeding, it should be understood that the terms used in this specification and the appended claims should not be construed as limited to the ordinary and dictionary meanings, but should be based on the principle of allowing the inventor to properly limit the terms for best interpretation and based on the same The meanings and concepts related to the technical aspects of the present invention should be understood.

[0055] Accordingly, the descriptions made herein are preferred examples for illustrative purposes only, and are not intended to limit the scope of the invention, so it should be understood that other modifications may be made to these preferred examples without departing from the spirit and scope of the invention. equivalent or modification.

[0056] Figure 6 is an exploded perspective view of a bracket for a double-side polishing device ac...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers.

Description

technical field [0001] The present invention relates to a carrier for a double-sided polishing apparatus and a double-sided polishing apparatus employing the same, and more particularly, to a lens on which the physical position and adjustment are made to achieve an optimum quality polishing process A bracket and a double-sided polishing device using the bracket. [0002] <Cross-references to related applications> [0003] This application claims priority from Korean Patent Application No. 10-2009-0077525 filed in Korea on Aug. 21, 2009, the entire contents of which are hereby incorporated by reference. Background technique [0004] In general, the silicon wafer processing process includes: a slicing process of cutting a single crystal ingot into thin disk-shaped wafers, chamfering of the wafer edges to prevent defects such as cracks, chipping, cracks, etc. grinding process to level the wafer, etching process to remove residual damage in the wafer, polishing process t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304B24B37/08B24B37/28
CPCB24B37/28B24B37/08H01L21/304
Inventor 李致福曹喜敦
Owner LG SILTRON
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap