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Plasma etching device, wafer fixture, and method for setting wafer

A technology for etching equipment and wafers, applied in chemical instruments and methods, circuits, crystal growth, etc., to achieve the effects of easy positioning, optimal space utilization, and improved production efficiency

Inactive Publication Date: 2014-06-25
ZHISHENG SCI & TECH GUANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Furthermore, since the outer contour of the wafer fixture is circular and has no directionality, it is desired to place the wafer fixture carrying the wafer into plasma etching When the electrode is on the equipment, it is not easy to position the wafer fixture, so it is impossible to use the robot arm to automatically place it, which needs to increase the working time and labor cost

Method used

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  • Plasma etching device, wafer fixture, and method for setting wafer
  • Plasma etching device, wafer fixture, and method for setting wafer
  • Plasma etching device, wafer fixture, and method for setting wafer

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Embodiment Construction

[0033] The lower electrode 2 is set in the reaction cavity 1, with a square body 21 and a cooling system 22.The cooling system 22 includes a pores 221, which is located in the top of the body 21 and facing the wafer 具 3. In this embodiment, the cooling system 22 is connected to the gas supply system (unlike icon) other than the reaction cavity.Provide cooling gases when etching wafers 5.

[0034] The wafer is covered on the lower electrode 2, and has a square plate 31 and one cover 32.The bottom plate 31 has multiple wafers 311, and each wafer capacity slot 311 can accommodate a wafer 5 respectively, and the wafer capacity slot 311 is connected to the cooling system 22, so that the cooling gas can be in the crystal in the crystalThe circular 5 weeks flow, take away the heat energy on the wafer 5.In this embodiment, the wafer capacity slot 311 is connected to the cooling system 22 with the cooling hole 312 worn on the bottom plate 31.

[0035] In the first better embodiment, the lo...

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Abstract

The invention discloses a plasma etching device, a wafer fixture, and a method for setting a wafer. The plasma etching device comprises a reaction cavity, a lower electrode, a wafer fixture, and an upper electrode arranged inside the reaction cavity and opposite to the lower electrode. The lower electrode is arranged inside the reaction cavity and has rectangular body. The wafer fixture covers the body of the lower electrode and has a square base plate, wherein the base plate is provided with a plurality of wafer containing grooves, with each wafer containing groove capable of containing a wafer. The plasma etching device can contain a lot of wafers, reach the optimal space-utilizing rate, raise the production efficiency, be easily positioned, and make automatic of the flow of loading a wafer to be inside the reaction cavity.

Description

Technical field [0001] The present invention involves a kind of plasma etching equipment and wafers, especially the method of carving equipment, wafers, and setting wafers that can automate the wafer etching equipment, wafers, and fab. Background technique [0002] The current plasma etching equipment for wafers is a circular electrode, and the treatment tool carrying the wafer is also matched with the electrode.Reference figure 1 Because the outer outline of the wafers 9 is circular, and the general wafer capacity slot 91 is arranged in an array, and it is roughly arranged in squares, which is limited by the circular boundary of the wafers of the wafer 具The overall area of the governance 9 has not been fully used.For example figure 1 It is shown that the width of the wafer capsule slot 91 is not tolerate in the part of the adjacent boundary area 92 (the square tank 91 outer area) of the square.The wafer capacity slot 91, so the 92 of these areas is a waste of space. [0003] Fu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B33/12H01L21/3065
Inventor 张宏隆陈庆安胡肇汇
Owner ZHISHENG SCI & TECH GUANGZHOU