Polishing disk capable of adjusting regional pressure

A polishing disc and pressure technology, used in abrasives, grinding tools, metal processing equipment, etc., can solve the problem of uneven polishing pressure distribution

Inactive Publication Date: 2012-06-20
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a regional pressure-adjustable polishing disc for the problem of uneve

Method used

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  • Polishing disk capable of adjusting regional pressure
  • Polishing disk capable of adjusting regional pressure
  • Polishing disk capable of adjusting regional pressure

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Embodiment Construction

[0013] The following embodiments will further illustrate the present invention in conjunction with the accompanying drawings.

[0014] see Figure 1~3 , the embodiment of the present invention is provided with piezoelectric sensor 1, polishing disc 2, slider chute pair 3, polyurethane polishing sheet 4 and round chuck 5; Described polishing disc 2 is provided with at least 2 circular rings and is divided into sectors block, the fan-shaped block is provided with a slider chute pair 3, and each fan-shaped block surface is pasted with 2 pieces of polyurethane polishing sheets 4, and between the 2 pieces of polyurethane polishing sheets 4, there is an inward hole for placing the piezoelectric sensor 1. The groove; The round chuck 5 used to fix the sector block is located on the outer edge of the polishing disc 2.

[0015] The polishing disc is divided into multiple fan-shaped blocks, and the pressure adjustment structure of the corresponding size can be combined according to the ...

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PUM

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Abstract

A polishing disk capable of adjusting regional pressure is disclosed, which relates to a mechanical polishing tool. The polishing disk capable of adjusting regional pressure is provided with a piezoelectric sensor, a polishing disk, slide block and slide groove pairs, polyurethane polishing plates and a circular chuck, wherein at least two circular rings are disposed on the polishing disk and divided into fan-shaped blocks; the slide block and slide groove pairs are disposed on the fan-shaped blocks; two polyurethane polishing plates are attached to the surface of each fan-shaped block; an inward groove for placing the piezoelectric sensor is disposed between the two polyurethane polishing plates; and the circular chuck for fixing the fan-shaped blocs is disposed on the outer edge of the polishing disk.

Description

technical field [0001] The invention relates to a mechanical polishing tool, in particular to an area pressure-adjusting polishing disk for chemical mechanical polishing technology. Background technique [0002] Integrated circuit (IC) manufacturing is the core of the electronic information industry and one of the most important high-tech technologies to promote the development of national economy and social informatization. 65% of the increase in the total output value of the national economy in developed countries is related to the IC industry ([1] Sun Yuhui, Kang Renke, Guo Dongming, etc. Silicon Wafer Clamping Technology in Chemical Mechanical Polishing [J]. Semiconductor Technology, 2004, 29( 4): 10-14). In recent years, semiconductor chips have been developing towards small size, high circuit density, high speed and low energy consumption. The line width design of integrated circuits has been reduced from 0.35 μm to the current 0.25 μm and 0.18 μm, and the number of m...

Claims

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Application Information

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IPC IPC(8): B24D13/00B24B37/26
Inventor 郭隐彪陈梅云王振忠郑茂江
Owner XIAMEN UNIV
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