Ultraviolet curing adhesive and preparation method thereof

A technology of curing glue and ultraviolet light, applied in the directions of adhesives, adhesive types, non-polymer adhesive additives, etc., can solve the problems of low elongation and high elastic modulus of ultraviolet curing glue, and achieve a wide range of applications. , excellent performance, high bonding reliability effect

Inactive Publication Date: 2012-06-20
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of low elongation and high elastic modulus of UV-curable adhesives in the prior art, the present invention provides a UV-curable adhesi

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Accurately weigh each raw material by the following weight percentages, CN966J75 (aliphatic urethane acrylate) of Sartomer Company: 50%, IBOA ((meth)isobornyl acrylate): 44%, photoinitiator 184 (1-hydroxyl Cyclohexyl benzophenone): 3%, photoinitiator TPO (2,4,6-trimethylbenzoyl diphenyl phosphorus oxide): 1%, TMTP: 2%; In the planetary power mixing mixer, vacuumize to -0.08MPa, stir at 500 rpm for 2 hours, stir evenly, let it air naturally to room temperature, and obtain a UV-curable adhesive with high elongation and low elastic modulus , sealed package.

Embodiment 2

[0018] Accurately weigh each raw material according to the following weight percentages, Corning's 6363: 55%, THFAA: 39.5%, photoinitiator 1173: 3%, photoinitiator TPO: 1%, NDM: 1.5%; Put it into the dual planetary power mixing mixer in turn, evacuate until the vacuum degree is -0.05MPa, stir at 750 rpm for 1 hour, stir evenly, let it air naturally to room temperature, and obtain ultraviolet light with high elongation and low elastic modulus. Light-curing adhesive, sealed packaging.

Embodiment 3

[0020] Accurately weigh each raw material according to the following weight percentages, 6120F-80 of Changxing Company: 70%, HDDA: 20%, photoinitiator 1173: 3%, photoinitiator 819: 2%, TDM: 5%; Add it to the dual planetary power mixing mixer in turn, evacuate to a vacuum degree of -0.06MPa, stir at 700 rpm for 1.5 hours, stir evenly, and let it air naturally to room temperature to obtain a product with high elongation and low elastic modulus. UV curable glue, sealed package.

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PUM

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Abstract

The invention relates to an ultraviolet curing adhesive with high elongation and low elastic modulus and a preparation method thereof. The ultraviolet curing adhesive comprises the following raw materials by weight percent: 25-70% of polyurethane-acrylate oligomer, 20-70% of propyleneesters active diluent, 2-7% of photoinitiator and 1-5% of mercaptan compound. The preparation method of the ultraviolet curing adhesive comprises the following steps: weighting the raw materials by weight percent, adding into a stirrer, vacuumizing until the vacuum degree is -0.08MPa to -0.05Mpa, stirring uniformly at the speed of 500-1,000r/min for 0.5-2h, and airing at normal temperature to obtain the ultraviolet curing adhesive. The ultraviolet curing adhesive with high elongation and low elastic modulus overcomes the defects of low elongation and high elastic modulus of the conventional ultraviolet curing adhesive and has excellent performance, high adhesion reliability and a wide range of application.

Description

technical field [0001] The invention relates to an ultraviolet light curing adhesive, in particular to an ultraviolet light curing adhesive with high elongation and low elastic modulus and a preparation method thereof, belonging to the field of adhesives. Background technique [0002] UV-curable adhesives have been widely studied due to their outstanding advantages such as fast curing speed, environmental friendliness, low energy consumption, and no solvent volatilization, and are rapidly promoted in various industries. However, UV-curable adhesives also have their own limitations. The elongation of conventional UV-curable adhesives is not high, and they cannot be used well in some occasions that require high elongation. In addition, the elastic modulus of conventional UV-curable adhesives is relatively high, and how to reduce the elastic modulus is also an urgent problem to be solved. Contents of the invention [0003] In order to solve the problems of low elongation and...

Claims

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Application Information

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IPC IPC(8): C09J175/16C09J11/06
Inventor 潘光君王建斌陈田安
Owner YANTAI DARBOND TECH
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