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Tape winding substrate with flexible chip-on-board structures of liquid crystal panel

A liquid crystal panel and substrate technology, applied in optics, instruments, electrical components, etc., can solve problems such as abnormal signal transmission, complex wiring of output terminals, and affecting the display quality of LCD panels, so as to avoid signal abnormalities and simplify wiring.

Active Publication Date: 2014-05-21
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] An object of the present invention is to provide a flexible chip-on-a-roll substrate of a liquid crystal panel, to solve the problem in the prior art that due to the limited width of the tape substrate and the continuous increase of the output lead wires, the output lead wires The wiring is becoming more and more complicated, and the distance between the leads of adjacent output terminals is getting smaller and smaller, which makes the signal transmission abnormal and affects the technical problems of the picture display quality of the LCD panel

Method used

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  • Tape winding substrate with flexible chip-on-board structures of liquid crystal panel
  • Tape winding substrate with flexible chip-on-board structures of liquid crystal panel
  • Tape winding substrate with flexible chip-on-board structures of liquid crystal panel

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Embodiment Construction

[0034] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced.

[0035] see figure 1 , figure 1 It is a structure diagram of the first preferred embodiment of the tape-and-reel substrate of the chip-on-flex structure of the liquid crystal panel in the present invention.

[0036] The tape substrate 10 includes a plurality of packaging units 11 , 12 , . The packaging unit 11 and the packaging unit 12 are disposed on the substrate body 101 . Before cutting, the packaging units are all disposed on the tape substrate 10 . The tape substrate 10 generally refers to a flexible circuit board (flexible circuit board), which generally includes a flexible polymer layer and a lead layer (not shown in the figure), and the lead layer is sandwiched between the flexible polymer layer. between layers.

[0037] read on figure 1 , taking the packaging unit 11 as an example, t...

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Abstract

A tape substrate (10, 20) of a chip-on-film structure of a liquid crystal panel (52), and the liquid crystal panel (52) using the tape substrate (10, 20). Encapsulation units (11, 12, 21, 22) of a plurality of chips-on-film structures are arranged along the long axis direction (M1) of the tape substrate (10, 20). In each encapsulation unit (11, 12, 21, 22), an output lead (112, 212) of the encapsulation unit (11, 12, 21, 22) is connected to a second side (114, 214) of the encapsulation unit (11, 12, 21, 22), and the output lead (112, 212) extends from the second side (114, 214) into the encapsulation unit (11, 12, 21, 22) and assumes a bent structure.

Description

【Technical field】 [0001] The invention relates to the field of liquid crystal display technology, in particular to a tape substrate with a chip-on-flex structure of a liquid crystal panel. 【Background technique】 [0002] With the continuous development of liquid crystal technology, the requirements for various components in the liquid crystal panel are getting higher and higher. [0003] Chip On Film (COF) packaging structures in the prior art basically use Tape Automated Bonding (TAB) technology for thermocompression packaging of the driver chip, and rolls For reel and feed. In use, each chip-on-flex structure can be sequentially cut from the tape substrate, and electrically connected between a transparent circuit on a glass substrate of a liquid crystal panel and a driving circuit board. There may be one or more flexible chip-on-chip structures between the glass substrate and the driving circuit board. The higher the resolution of the liquid crystal panel, the greater th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13H01L27/12
CPCH01L23/4985H01L2924/0002H01L23/498G02F1/13G02F1/13452
Inventor 林柏伸廖良展张勇
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD