Double-platform structure of ACF (Anisotropic Conductive Film) and MB (Main Bonding) in fully-automatic COG (Chip on Glass) bonder

Abstract

The invention discloses a double-platform structure of ACF (Anisotropic Conductive Film) and MB (Main Bonding) units in a fully-automatic COG (Chip on Glass) bonder, which comprises a bracket, a linear guide rail and an installation panel, wherein the installation panel is provided with a first platform, a second platform, two ball guiding shaft suites, two vertical rotating shafts and a pair of synchronous pulleys. The first platform and the second platform are driven by the pair of synchronous pulleys to rotate through the two ball guiding shaft suites and the two vertical rotating shafts, and the lower part of the bracket is provided with two horizontal rotating shafts and a sensor. The linear guide rail is arranged at the upper part of a bracket body of the bracket, and the installation panel slides up and down through the linear guide rail. In this way, the double-platform structure of ACF and MB units in the fully-automatic COG bonder has compact installation configuration and can rotate and move up and down, the mechanical performance is stable, and the production cost is low.

Description

technical field [0001] The invention relates to the field of electronic communication technology manufacturing, in particular to a double-platform structure of ACF and MB units in a fully automatic COG bonding machine. Background technique [0002] At present, in the manufacture of electronic communication, COG (chip on glass) is to directly bind the chip on the liquid crystal display LCD, collectively called COG bonding machine, and use COG bonding machine to process Liquid Crystal Display (LCD for short) The unit includes: Anisotropic Conductive Film (ACF for short), preload and Main Bonding (MB for short). [0003] Among them, the double-platform structure of ACF and MB units has the function of vacuum adsorption. The platform carries out X-axis and Y-axis direction transportation through the intelligent combination mechanism of rolling guide rails, and sends the obtained LCD liquid crystal display to the lower part of the ACF unit and MB unit for processing. attach. Be...

AI Technical Summary

Problems solved by technology

During the working process of the existing dual platforms of ACF and MB units, due to the need for multi-directional adjustments to cater to the positioning and processing position of the product, the mechanical structure is unstable, which increases the working time of the whole machine debugging for the staff, and the production cost is high.

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