Sucking disc device used for transferring semi-conductor crystal grains on graphite boat

Abstract

The invention discloses a sucking disc device used for transferring semi-conductor crystal grains on a graphite boat, which comprises a handle and a cover plate, wherein a baseplate is mounted on the lower surface of the cover plate; movable through hole plugs formed by upper plug bodies and lower plug bodies are in clearance fit with air leakage through holes; the width of an upper air guide rib is larger than that of a lower air guide rib; the diameter of the lower end surface part and the upper end surface part is larger than that of air leakage through holes; the distance between the upper end surface part and lower end surface part of each movable through hole plug is larger than the thickness of each air leakage through hole, so as to ensure that the movable through hole plugs can move up and down along the air leakage through holes; when the lower plug bodies of the movable through hole plugs seal the air leakage through holes, the airflow flows in from suction nozzles; and when the upper plug bodies of the through hole plugs seal the air leakage through holes, the airflow flows in from the air leakage through holes. The sucking disc device provided by the invention solves the technical problem that when absorbed, the semi-conductor crystal grains are easy to be damaged during the manufacturing process, greatly improves the adsorption rate and the product yield, and reduces the resource wastage.

Description

technical field [0001] The invention relates to a tool for diode production, in particular to a sucker device for transferring semiconductor crystal grains on a graphite boat. Background technique [0002] Existing semiconductor grains often involve a variety of production processes, which require semiconductor grain transfer. In the prior art, in the process of adsorption or transfer, the crystal grains often encounter the pre-welding boat and the assembly welding boat, which may damage the crystal grains and cause the final product to be defective; secondly, due to the flatness of the gas nozzle or the wear of the gas nozzle The reason is that the distance between the individual gas nozzle and the die is too large, so that the whole die cannot be completely sucked up. [0003] The prior art solves the above technical problems by adopting the technical solution of Chinese Patent Application No. 201110217430.5, which records that an air leakage device is installed on the or...

AI Technical Summary

Problems solved by technology

When the sucker is sucking the grain, the air always passes through the suction nozzle during the descent process. When the distance between the suction nozzle and the grain is about 1 mm, the grain has been sucked. At this time, the suction cup continues to move downward, bringing The sucked crystal grains continue to move downward, and if the grains are a little bit misaligned when they are sucked, they will touch the edge of the square hole of the metal plate or graphite plate during the descent, so that the grains will crushed

Secondly, the suction nozzle in the prior art is always adsorbing in the working state, which easily leads to a long adsorption time of the crystal grains, and more easily leads to the deviation of the grains

Thirdly, because the graphite boat places a large number of semiconductor grains, and the size of the semiconductor grains is very small, it is inevitable that a small amount of semiconductor grains will not be adsorbed at the same time when a large number of tiny semiconductor grains are adsorbed at one time, resulting in the need for multiple adsorptions. The frequency of operation is greatly increased, which is not conducive to the improvement of efficiency

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