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Double-layer metal frame built-in inductance integrated circuit

A double-layer metal and integrated circuit technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of separate installation steps and occupying circuit area, and achieve the effect of saving installation steps, reducing overall cost and enhancing inductance coefficient

Inactive Publication Date: 2012-07-04
SUZHOU BATELAB MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, inductors exist in the form of discrete components in electronic circuits, which not only occupy the area of ​​the circuit, but also require a separate installation step

Method used

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  • Double-layer metal frame built-in inductance integrated circuit
  • Double-layer metal frame built-in inductance integrated circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] A double-layer metal frame built-in inductance integrated circuit, which has a first metal frame 1, a chip 2, an inductor 3, an alloy core 4, a second metal frame 6 and packaging materials 5, the first metal frame 1, a chip 2. The inductor 3, the alloy core 4, and the second metal frame 6 are all arranged inside the packaging material 5. The chip 2 is fixed on the first metal lead frame 1 , the alloy magnetic core 4 is arranged inside the inductor 3 , and the inductor 3 is arranged inside the second metal frame 6 .

[0013] The inductance 3 is placed around the chip 2, and the plane surrounded by the coil of the inductance 3 and the plane on which the chip 2 is placed form any angle between 0° and 180°.

[0014] The number of inductance 3 is at least one; When inductance 3 is multiple (such as figure 1 shown), the connection method of the inductor 3 is series connection, parallel connection, both series connection and parallel connection, or independent connection with...

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PUM

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Abstract

The invention discloses a double-layer metal frame built-in inductance integrated circuit, which comprises a chip, an inductor, an alloy magnetic core, a first metal frame, a second metal frame and a packaging material, wherein the chip is fixed on a first metal lead frame; the alloy magnetic core is arranged inside the inductor; the inductor is arranged inside the second metal frame; the second metal frame is grounded; and the chip, the inductor, the alloy magnetic core and the two metal frames are arranged inside the packaging material. The inductor and the chip are packaged together, the circuit area is saved, the mounting steps are reduced, an integration level of the system is improved, the performance is improved, and the overall cost is reduced. The second grounded metal frame is coated with the inductor so as to provide magnetic shielding, the magnetic interference of the inductor with the chip is effectively reduced, and the overall performance of the system is improved.

Description

Technical field: [0001] The invention relates to components and devices in electronic technology, which is an integrated circuit, specifically, an integrated circuit with built-in inductance in a double-layer metal frame. Background technique: [0002] Inductors are indispensable components in electronic technology. As electronic products continue to develop towards miniaturization and low power consumption, electronic circuits are simultaneously developing towards high density and miniaturization. Currently, inductors exist in the form of discrete components in electronic circuits, which not only occupy the area of ​​the circuit, but also require a separate installation step. In the integrated circuit, there is a large space available on the outer periphery of the chip and the packaging material. Packaging the inductor and the chip together not only saves the area of ​​the circuit, but also saves the steps of installation, and at the same time improves the system integrati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/522H01L23/552
CPCH01L2924/0002
Inventor 李真
Owner SUZHOU BATELAB MICROELECTRONICS