Planar moving target mechanism

Abstract

The invention discloses a planar moving target mechanism. The mechanism comprises a frame, a back-and-forth transmission mechanism, two linear guide rail mechanisms, a pole shoe, a permanent magnet, and a cathode and a target which are positioned in a vacuum box, wherein the back-and-forth transmission mechanism is arranged in the middle of the frame; the two linear guide rail mechanisms are arranged on the upper part and the lower part of the frame respectively and are provided with at least one sliding block respectively; the pole shoe is arranged in the middle of the back-and-forth transmission mechanism; the upper end and the lower end of the pole shoe are fixed on the sliding blocks of the two linear guide rail mechanisms respectively; the permanent magnet is arranged on the pole shoe; the cathode is arranged at the bottom of the vacuum box above the permanent magnet; and the target is arranged above the cathode. Due to the movement of a magnetic field, electrons in a discharging area can be expanded, and the utilization rate of the target can be improved to 40 to 45 percent; and the effects of saving energy and reducing the cost are achieved.

Description

technical field [0001] The invention relates to a sputtering target for coating, in particular to a planar moving target mechanism. Background technique [0002] At present, the rectangular planar magnetron sputtering target has been widely used in industrial coating due to its simple structure, high deposition rate, low substrate temperature, strong combination of film and substrate, easy to enlarge, and not affected by the type of substrate. However, due to the non-uniform erosion of the target surface in the production process of this system, the utilization rate of the target material will be reduced (the general utilization rate is 10%-20%), which will affect the uniformity of the coating film, and will cause arcing and poisoning of the target, seriously Affect product quality and production cycle. The research and development of a new type of mobile planar target structure can increase the utilization rate of the target to 40%-45%, which is of great significance to im...

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Problems solved by technology

[0003] The purpose of the present invention is to propose a planar moving target mechanism for the low utilization rate of the target material and low coating uniformity in the rectangular planar magnetron sputtering target; the movement of the magnetic field expands the electronic runway in the discharge area Target utilization can be increased to 40%-45%

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