Exposure method and exposure apparatus
A technology of exposure device and exposure method, which is applied in the direction of photolithography exposure device, microlithography exposure equipment, optics, etc., can solve the problems that have not been recorded, and have not taken into account the suppression of light source consumption, power consumption, and light source fluctuations, etc., to achieve the suppression of temperature rise , The effect of suppressing power consumption and reducing the burden
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Embodiment 1
[0029] FIG. 1 schematically shows an exposure apparatus according to a first embodiment of the present invention. In addition, in the following description, two directions parallel to and perpendicular to the photosensitive surface of the glass substrate as the object to be exposed are defined as the X axis and the Y axis, and the direction in which the exposure beam is perpendicularly incident on the glass substrate is defined as for the Z axis. In addition, regarding the X-axis, Y-axis, and Z-axis, the directions indicated by the arrows in FIG. 1 are each positive.
[0030] The exposure apparatus 1 of the present embodiment includes a light source module 2 , an exposure stage 8 , an LED lighting unit 12 , a stage drive unit 18 , a substrate insertion / extraction unit control unit 19 , a controller 10 , and a memory 11 .
[0031] The light source module 2 has: an LED light source 22, which arranges ultraviolet LEDs 21 two-dimensionally at predetermined intervals on the XY pla...
Embodiment 2
[0068] An exposure apparatus according to Example 2 of the present invention will be described. The structure of the exposure apparatus in this example is the same as that shown in FIG. 1 described in Example 1. FIG.
[0069] In addition, the operation flow of the exposure device in this embodiment is the same as figure 2 The procedures described in Example 1 are the same. Figure 7 Exposure conditions in step S103 of the operation flow are shown. exist Figure 8 expressed in Figure 7 The exposure conditions shown are changes in temperature detected by the temperature sensor 24 when the LED light source 22 is turned on.
[0070] Figure 7 The graph shown is an example in which the exposure in step S103 is performed in one pulse. By making the energization time of one pulse instantaneous, since the exposure intensity is high, the total exposure light amount reaches the exposure light amount required for the glass substrate 3 coated with the photosensitive agent as the o...
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