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Photosensitive water developing corrosion-resistant composition and photosensitive water developing corrosion-resistant dry film

A technology of resist composition and water development, applied in the directions of optics, photography, optomechanical equipment, etc., can solve the problems of waste, easy disconnection, insufficient adhesion, etc.

Inactive Publication Date: 2012-07-25
HUIZHOU LIANDA ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is a problem to be solved in the production and use of traditional dry films: most dry films are developed by solvent after exposure, and some dry films can also be developed with water, but when etching a line width below 0.5mm, due to Its adhesion is not enough, it is prone to disconnection, resulting in uncontrollable waste

Method used

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  • Photosensitive water developing corrosion-resistant composition and photosensitive water developing corrosion-resistant dry film
  • Photosensitive water developing corrosion-resistant composition and photosensitive water developing corrosion-resistant dry film
  • Photosensitive water developing corrosion-resistant composition and photosensitive water developing corrosion-resistant dry film

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Embodiment Construction

[0038] In order to make the above objects, features and advantages of the present invention more obvious and comprehensible, a detailed description will be made below in conjunction with specific embodiments. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0039] In order to solve the problems existing in traditional dry films, a water-soluble mixture formulation is now provided for the production of anti-etching dry films for printed circuit boards.

[0040] One embodiment of the photosensitive aqueous development resist composition is composed of acrylate, polyvinyl al...

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Abstract

The invention relates to a photosensitive water developing corrosion-resistant composition and a photosensitive water developing corrosion-resistant dry film. The photosensitive water developing corrosion-resistant composition consists of acrylate, polyvinyl alcohol acrylate-benzoic anhydride half-ester, pentaerythritol triacrylate, monoanhydride half-ester, a photoinitiator, a plasticizer, an inorganic filler, a coloring agent, a tackifier, a leveling defoaming agent, a coupling agent, an emulsifying agent, a polymerization inhibitor and balance of water. As the polyvinyl alcohol acrylate-benzoic anhydride half-ester is used, the photosensitive water developing corrosion-resistant composition can provide water solubility, water developing property, high film-forming property and contact dryness and has high adhesive force when applied to circuit board etching.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a photosensitive water-developable resist composition and a photosensitive water-developable resist dry film. Background technique [0002] The traditional anti-etching patterns of printed circuit boards are usually produced by the following methods: direct printing of circuit patterns by screen plate; coating of photosensitive wet film to cure and then exposure and development to produce circuit patterns; exposure and development of photosensitive dry film to produce circuit patterns. However, there are problems to be solved in the production and use of traditional dry films: most dry films are developed by solvent after exposure to light, and some dry films can also be developed with water, but when etching a line width below 0.5mm, due to Its adhesion is not enough, and it is prone to disconnection, resulting in uncontrollable waste. Contents of the invention [0003] ...

Claims

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Application Information

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IPC IPC(8): G03F7/039G03F7/00
Inventor 赖卓宏
Owner HUIZHOU LIANDA ELECTRONICS MATERIAL
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