Radio-frequency power amplifier multichip module and generation method thereof

Abstract

A radio frequency (RF) power amplifier includes: a pre-stage amplifier configured to amplify an input power to the RF power amplifier; and a post-stage amplifier configured to amplify an output power of the pre-stage amplifier; wherein the pre-stage amplifier comprises a CMOS (Complementary Metal Oxide Semiconductor) amplifier, and the post-stage amplifier comprises a GaAs (Gallium Arsenide) amplifier or a SiGe (Silicon Germanium) amplifier.

Description

technical field [0001] The invention relates to a radio frequency circuit, in particular to a radio frequency power amplifier and a packaging method thereof. Background technique [0002] In the production field of power amplifier multi-chip modules, the structure of traditional RF power amplifiers is as follows: figure 1 shown. figure 1 It is a structural schematic diagram of a radio frequency power amplifier in the prior art. Such as figure 1 As shown, in the prior art, the radio frequency power amplifier usually includes a GaAs (gallium arsenide) die for amplification of the signal path; a PHEMT (Pseudomorphic HEMT, pseudo-type high electron mobility transistor) Switch die , used to switch and switch the transceiver frequency band; a CMOS (Complementary Metal Oxide Semiconductor, Complementary Metal Oxide Semiconductor) controller die is used to provide bias and control signals for the signal amplification module and the switch module. In different applications, there...

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Problems solved by technology

The advantage of this solution is low cost, and the disadvantage is that the technology is difficult and the performance is difficult to improve

[0004] Generally speaking, the RF power amplifier needs to provide an output power of about 27 ~ 35dBm. figure 2 The power amplifier scheme of the pure CMOS process shown has its power consumption, size and reliability tested, and it is difficult to compare with the performance in terms of performance. figure 1 The GaAs scheme shown is quite

while using as figure 1 Although the size of GaAs bare chips has been continuously reduced in recent years with the efforts of various companies, the high price of GaAs wafers makes this type of product still face considerable cost pressure.

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