Circuit board manufacturing process

Abstract

The invention discloses a circuit board manufacturing process and mainly provides the circuit board manufacturing process which can greatly reduce gold-plated cost. In the circuit board manufacturing process, a solder mask covers a non electrode joint of an outer copper foil substrate. Finally, gold-plated processing is performed on the outer copper foil substrate so that a gold-plated surface is established on the copper foil surface of the electrode joint which is not covered by the solder mask. Therefore, a gold-plated scope can be narrowed to the electrode joints, such as a bonding pad, a connecting line, an external electrode contact and the like. And a purpose of reducing the gold-plated cost can be achieved.

Description

technical field [0001] The invention relates to a circuit board manufacturing technology, in particular to a circuit board manufacturing process that can greatly reduce the cost of gold plating. Background technique [0002] Press, the printed circuit board [Printed circuit board (PCB)] will appear in almost every electronic device, in addition to fixing various electronic components, and providing electrical connections for each electronic component. At present, common printed circuit boards can be divided into single-sided boards, double-sided boards, multi-layer boards with four or more layers, and flexible boards. [0003] Generally speaking, the more complicated the functions of electronic products, the longer the loop distance, and the more contact pins, the more layers required for printed circuit boards, such as high-end consumer electronics, information and communication products, etc.; secondly, printed circuit boards In order to ensure the chemical resistance, ox...

AI Technical Summary

Problems solved by technology

[0005] However, in the manufacturing process of conventional printed circuit boards, the gold plating step is often arranged between the first copper and the second copper, and the copper foil substrate is fully gold-plated, and then the gold-plated layer at the electrode connection is etched with chemicals, not only A large amount of gold salt material is wasted, which relatively increases the gold plating cost of printed circuit boards

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