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Partial gold plating process for hybrid integrated circuit shell lead

A mixed integrated circuit and partial gold plating technology, which is applied in the direction of metal material coating process, liquid chemical plating, superimposed layer plating, etc., can solve the problem of high cost, achieve the effect of reducing cost and simplifying the gold plating process

Pending Publication Date: 2022-03-01
SHENZHEN HONGGANG MECHANISM & EQUIP
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the related technologies mentioned above, the inventor believes that for hybrid integrated circuits, the leads need to be plated with nickel and then plated with gold, while the shell does not need to be plated with gold, and the process of overall gold plating leads to high cost

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  • Partial gold plating process for hybrid integrated circuit shell lead

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Embodiment Construction

[0032] The following is attached figure 1 The application is described in further detail.

[0033] The embodiment of the present application discloses a partial gold plating process for the leads of a hybrid integrated circuit casing. refer to figure 1 , the local gold plating process of the lead wire of the hybrid integrated circuit includes the following steps:

[0034] Between the shell and the gold plating of the leads, the shell and the leads need to be packaged into one body, wherein one end of the lead passes through the shell, and a glass insulator is arranged between the shell and the leads, and the glass insulator is fixed to the shell and the leads at the same time connect.

[0035] S100: Soaking and decontamination, put the casing and leads of the hybrid integrated circuit into potassium ferricyanide solution, heat and soak, so as to clean the oil stains on the casing, leads and glass insulators, and reduce the resulting damage to the glass insulators The insul...

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Abstract

The invention relates to a partial gold plating process for a shell lead of a hybrid integrated circuit, which belongs to the field of partial gold plating and comprises the following steps of: S100, digesting and decontaminating: putting the shell and the lead of the hybrid integrated circuit into a decontaminating solution for digesting; s200, electrolytic degreasing is conducted, specifically, the shell and the lead are placed into an electrolytic solution to be electrolyzed; s300, carrying out acid activation, and removing oxide layers on the surfaces of the shell and the lead; s400, nickel pre-plating is carried out; s500, plating thin gold; and S600, local gold plating is carried out, a hanging tool used for hanging the shell and the lead comprises an electrifying area and an insulating area, the lead is connected with the electrifying area of the hanging tool through an electroplating hanging line, the shell is connected with the insulating area of the hanging tool through the electroplating hanging line, and the shell is put into the gold plating solution again for gold plating. The method has the effect of reducing the process cost.

Description

technical field [0001] The present application relates to the field of partial gold plating, in particular to a partial gold plating process for the casing leads of a hybrid integrated circuit. Background technique [0002] Hybrid integrated circuits are integrated circuits made by combining semiconductor integration technology and thin film technology. Hybrid integrated circuits are made of thick film or thin film components and their interconnection lines on the substrate by film formation method, and discrete semiconductor chips, monolithic integrated circuits or micro components are mixed and assembled on the same substrate, and then packaged. [0003] Hybrid integrated circuits usually use overall nickel-plating and gold-plating, where nickel-plating is for corrosion protection, and gold-plating is mainly to ensure the bonding strength and solderability of the leads. [0004] Regarding the related technologies mentioned above, the inventor believes that for hybrid inte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/02C23C18/18C23C18/20C23C18/32C25D5/02C25D5/14C25D5/54C25D5/56C25D7/00C25D7/06C23C18/28
CPCC23C28/023C25D5/14C25D5/02C25D7/0607C25D5/54C25D5/56C23C18/32C25D7/00C23C18/1848C23C18/1834C23C18/1896C23C18/1882C23C18/2066C23C18/2093
Inventor 郭志平严庆许乐
Owner SHENZHEN HONGGANG MECHANISM & EQUIP
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