Manufacturing method of printed circuit board
A technology for printed circuit boards and printed circuits, which is applied to the formation of electrical connection of printed components, etc., can solve the problems of difficult manufacturing process, concave holes on the board, and high electroplating cost, and achieves the reduction of chemical pollution, strong hole filling ability, and environmental protection. Effect
Active Publication Date: 2015-01-07
MEIZHOU ZHIHAO ELECTRONICS TECH +2
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Problems solved by technology
[0005] However, there are obvious deficiencies in the above two methods: the flow of resin varies with the distribution of holes and graphics in the former, resulting in uneven thickness of the medium and dimple-like depressions at the orifice of the board surface; and the problem of the latter is that It is difficult to control defects such as ink voids and bubbles
These defects all bring difficulties to the product manufacturing process and leave hidden dangers to the quality of the product, especially when filling the pre-filled holes on the printed circuit board substrate, the electroplating filling technology has the advantages of high plating cost, thick copper layer and requires Copper reduction treatment, at the same time, the above method is difficult to fill small holes, and it is easy to form voids; silk screen filling technology has the disadvantages that small holes are easy to form voids, the surface is sunken, and good electrical interconnection cannot be performed.
Method used
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[0025] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0026] Please also see figure 1 , Figure 2a-Figure 2i , figure 1 It is a schematic flow diagram of a specific embodiment of the method for manufacturing a printed circuit board of the present invention, Figure 2a-Figure 2i yes figure 1 The schematic cross-sectional structure diagram of each step of the manufacturing method of the printed circuit board shown, the manufacturing method of the printed circuit board specifically includes:
[0027] Step S1, providing a printed circuit board substrate with pre-filled holes;
[0028] see Figure 2a , the printed circuit board substrate 100 is generally a multi-layer printed circuit board substrate, and a certain pattern of circuits (not shown) has been pre-formed on the surface of each layer of the circuit board substrate. A plurality of pre-filled holes 11 with different depths and different ...
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The invention relates to a manufacturing method of a printed circuit board. The manufacturing method comprises the steps of: providing a printed circuit board substrate with pre-filling holes; arranging a mask on the surface, provided with the pre-filling holes, of the printed circuit board substrate, wherein through holes corresponding to the pre-filling holes of the printed circuit board substrate are formed on the mask; arranging a stuffer layer on the surface of the mask; arranging a protection layer on the stuffer layer; performing press-fit on a lamination structure including the printed circuit board substrate, the mask, the stuffer layer and the protection layer so as to make the stuffer layer fully fill the pre-filling holes of the printed circuit board substrate; and removing the mask, the stuffer layer and the protection layer from the surface of the printed circuit board substrate. The manufacturing method of the printed circuit board has the advantages of simple process and completeness as well as uniformity in filling the pre-filling holes.
Description
technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for filling pre-filled holes in the manufacturing process of the printed circuit board. Background technique [0002] Printed Circuit Board (PCB) is the basis of almost any electronic product and appears in almost every electronic device. Generally speaking, if there are electronic components in a certain device, they are also integrated on printed circuit boards of various sizes. [0003] As the functions of electronic products are increasingly enhanced and their popularity is getting higher and higher, the requirements for printed circuit boards used in electronic products are also correspondingly increased. [0004] In the manufacturing process of printed circuit boards, especially multi-layer printed circuit boards, it is often necessary to drill the circuit board first, and after completing a part of the manufacturing process, the drilled holes ...
Claims
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IPC IPC(8): H05K3/40
Inventor 徐学军
Owner MEIZHOU ZHIHAO ELECTRONICS TECH