Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Silicon wafer-cutting waste slurry recovery method

A recycling method and silicon wafer cutting technology, applied in the direction of silicon carbide, carbide, lubricating composition, etc., can solve the problems of large amount of waste water, consumption of fluorine ions, high pollution, etc., achieve low operating costs, save treatment costs, protect environmental effects

Active Publication Date: 2014-05-21
泗阳瑞泰光伏材料有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, although some manufacturers have started to recycle, but mostly adopt the method of acid-base washing, the amount of wastewater generated is very large, and about 100 tons of alkali washing wastewater and pickling wastewater can be produced per ton of sand, forming a secondary high Pollution, high investment cost of environmental protection treatment in the later stage, at the same time, a large amount of caustic soda and fluoride ions are consumed in the acid-base washing process, and the cost investment is high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon wafer-cutting waste slurry recovery method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Step 1. Preprocessing:

[0021] Use a pump to send the original mortar and water to the mortar mixing tank at a ratio of 2:3 by volume, carry out effective and uniform stirring for 30 minutes, and then send it to the first-stage filter press through the feed pump for solid-liquid separation, and the solid forms a filter cake and remains in the On the filter plate, the liquid is sent to the solid-liquid separation tank.

[0022] Step 2, the recovery of Polyethylene Glycol:

[0023] The liquid in the solid-liquid separation tank is pumped to the filter press to remove particles, and the filter press is circulated for 10-15 minutes. During the cycle, samples are taken from the faucet of the filter press to observe the particles in the filtrate. Stop circulation if no small particles are visible. If the filtrate is still turbid after 15 minutes of circulation, stop the circulation, loosen the filter plate to clean the filter cloth and continue to press the filter until th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a silicon wafer-cutting waste slurry recovery method, which adopts a physical treatment process. The silicon wafer-cutting waste slurry recovery method includes the following steps of: (step 1) pretreatment: solid-liquid separation is carried out; (step 2) recovery of polyethylene glycol on a liquid line: the filtrate obtained by separation in the first step undergoes particle-removing pressing, decoloration, ion exchange, four-effect distillation and cooling, so that the finished polyethylene glycol product is obtained; and (step 3) recovery of silicon carbide on a solid line: the filter cake obtained in the first step undergoes primary filter pressing, secondary filter pressing, drying and impurity separation by a separator, so that the finished silicon carbide product is obtained. The silicon wafer-cutting waste slurry recovery method not only has the advantages of large separation capacity, high recovery rate and good quality of recovered polyethylene glycol and silicon carbide, but also realizes environment-friendliness and zero-pollution treatment, and also reduces the production cost.

Description

technical field [0001] The invention relates to a method for recovering waste mortar from silicon chip cutting, which is mainly used for processing the waste mortar produced after silicon chip cutting, and recovering polyethylene glycol and silicon carbide therein. Background technique [0002] The process of human modernization continues to accelerate, and non-renewable resources such as coal and oil are also becoming increasingly exhausted. As a new energy source, solar energy has been strongly supported by governments of various countries. The solar photovoltaic industry has developed rapidly, and its related industries have also risen rapidly. The used silicon carbide waste mortar can be recycled and reused, which can save costs and protect the environment. At present, although some manufacturers have started to recycle and treat, but mostly adopt the method of acid-base washing, the amount of waste water generated is very large, and about 100 tons of alkali washing wast...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C10M175/00C08G65/34C01B31/36C01B32/956
Inventor 罗英明
Owner 泗阳瑞泰光伏材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products