The invention discloses a waste silicon wafer-cutting fluid processing method and a silicon carbide rinsing device. The processing method includes the following steps that: (A) water is added to dilute waste silicon wafer-cutting fluid and mixed, and a magnet is used for attracting iron; (B) flocculant is added, and solid and liquid are separated; (C) water is added to dilute the solid, and the silicon carbide suspension is added with sodium hydroxide, heated for reaction, washed by water, added with acid and washed until the pH value reaches 6.5 to 7, so that a crude silicon carbide product is obtained; (D) the crude product is separated, and after drying, a finished silicon carbide product is obtained; (E) the liquid is filtered, and after dehydration, a finished polyethylene glycol product is obtained. The scheme increases the purity of the sodium carbide, and reduces the consumption of acid and alkaline. The silicon carbide rinsing device comprises a rinsing bucket, the sidewall of the rinsing bucket is provided with a plurality of decanting outlets, the end of the rinsing bucket is provided with a water inlet tube, and a water distributor is arranged in the cone; the wall of the rinsing bucket is also provided with an air inlet, and an air tube is arranged in the bucket, and is provided with a plurality of microporous air distributors. The device can prevent the sediment of silicon carbide, thus enhancing the rinsing effect.