Heat treatment apparatus and temperature measuring method thereof

A technology of heat treatment device and temperature measurement, which is applied to thermometers, thermometers, and measuring devices using electric/magnetic elements that are directly sensitive to heat, and can solve the problems of high prices and increased costs of R thermocouples and S thermocouples

Inactive Publication Date: 2012-08-22
TOKYO ELECTRON LTD
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] On the other hand, the Seebeck coefficients of R thermocouples and S thermocouples do not change, but the prices of these R thermocouples and S thermocouples are high, resulting in an increase in cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat treatment apparatus and temperature measuring method thereof
  • Heat treatment apparatus and temperature measuring method thereof
  • Heat treatment apparatus and temperature measuring method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] Embodiments of the present invention will be described below with reference to the drawings.

[0018] exist figure 1 Among them, a vertical heat treatment apparatus 1 has a vertical heat treatment furnace 2 capable of accommodating a plurality of objects to be processed at a time, such as semiconductor wafers W, and performing heat treatments such as oxidation, diffusion, and reduced-pressure CVD. This heat treatment furnace 2 comprises: a furnace main body 5, which is provided with a heating resistor (heater) 18A on the inner peripheral surface; space 33, and the processing container 3 is used to house the wafer W for heat treatment.

[0019] In addition, the space 33 between the furnace main body 5 and the processing container 3 is divided into a plurality of unit areas (also simply referred to as areas), for example, 10 unit areas A along the longitudinal direction. 1 、A 2 、A 3 、A 4 、A 5 、A 6 、A 7 、A 8 、A 9 、A 10 . In addition, the heater 18A and the 10 u...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a heat treatment apparatus and a temperature measuring method thereof. The heat treatment apparatus is aimed to reducing the set-up cost of a thermocouple with no need of correcting the signal from the thermocouple. An in-furnace temperature sensor (50) in a reference area (A1) is provided with a first thermocouple (81) formed by an R thermocouple or an S thermocouple, a second thermocouple (82) formed by thermocouples except the R and S thermocouples; and in-furnace temperature sensors in other areas (A2,......,A10) are provided with second thermocouples. The second thermocouple in the reference area and the second thermocouples in other areas are connected with an electromotance difference circuit (83), and the electromotance difference circuit is used for solving the temperature difference between the reference area and other areas. The temperatures in other areas are solved through using the temperature of the reference area solved by the first thermocouple in the reference area and using the temperature difference of other areas solved through using the temperature of the reference area and the electromotance difference circuit.

Description

technical field [0001] The invention relates to a heat treatment device and a temperature measurement method for the heat treatment device. Background technique [0002] In the manufacture of semiconductor devices, various heat treatment apparatuses are used for performing heat treatments such as oxidation, diffusion, CVD, and annealing on a target object, such as a semiconductor wafer. As one of these heat treatment apparatuses, there is known a vertical heat treatment apparatus capable of heat-treating a plurality of processing objects at a time. The vertical heat treatment device includes: a processing container made of quartz and having an opening in the lower part; a cover for opening and closing the opening of the processing container; a holder provided on the cover, A plurality of objects to be processed are kept at predetermined intervals in the vertical direction; a furnace main body is provided around the processing container, and is installed for heating the obje...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/67F27B17/00F27D19/00G01K7/04
CPCF27D19/00F27D21/0014F27D21/04G01K1/026G01K7/04G01K7/42G01K13/00H01L21/67109H01L21/67248H01L21/324
Inventor 菅野聪一
Owner TOKYO ELECTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap