Detection method for detecting substrate damage in placing box and placing box

Abstract

The embodiment of the invention provides a detection method for detecting substrate damage in a placing box and the placing box, and relates to the field of liquid crystal panel manufacture. The detection method can detect if substrates are damaged in the placing box, so that the rate of finished products of the follow-up technique is ensured. The placing box comprises a placing box frame, a top metal plate positioned on the top of the placing box, and a bottom metal plate positioned at the bottom of the placing box frame, wherein multiple layers of substrate placing frames are arranged on the placing box frame, and at least one pressure sensor is arranged on each layer of substrate placing frame of the placing box, or at least one pressure sensor is arranged on every other of the substrate placing frame of the placing box; the pressure sensors are used for acquiring the pressure values of the substrates placed on the substrate placing frame; a data processing unit is connected with the pressure sensors on the substrate placing frames respectively and is used for determining that whether the substrates placed on the substrate placing frames are damaged or not according to the pressure values acquired by the pressure sensors. The embodiment of the invention is used for detecting the substrates in the substrate transporting process.

Description

technical field [0001] The invention relates to the field of liquid crystal panel manufacture, in particular to a method for detecting damage to a substrate in a placement box and the placement box. Background technique [0002] In the process of TFT-LCD (Thin Film Transistor-Liquid Crystal Display, Thin Film Field Effect Transistor Liquid Crystal Display) array process, usually the substrate needs at least 4 times of film formation, photolithography, etching, stripping and other processing processes. In the process, the substrate needs to be transported back and forth between the equipment. Generally, the substrate is placed in a storage box for transportation, and the entire transportation process is fully automated. When a problem occurs in the process equipment and the substrate is damaged, some equipment has limited detection capabilities or no substrate damage detection device at all. The substrate cannot be detected effectively, so the yield of the array substrate wi...

AI Technical Summary

Problems solved by technology

Generally, the substrate is placed in a storage box for transportation, and the entire transportation process is fully automated. When a problem occurs in the process equipment and the substrate is damaged, some equipment has limited detection capabilities or no substrate damage detection device at all. The substrate cannot be detected effectively, so it will seriously affect the yield of the array substrate in the subsequent production process

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