Pneumatic hot-press device

Abstract

The invention discloses a pneumatic hot-press device, comprising a support, wherein a lower thermal press plate is fixed on the support, an upper thermal press plate and a piston cylinder switching plate are respectively arranged above and under the lower thermal press plate, and the upper thermal press plate, the lower thermal press plate and the piston cylinder are sequentially connected through a guide column to form an integrated movement assembly; an upper thermal press head is arranged on the lower surface of the upper thermal press plate; a sliding assembly capable of transversely moving is arranged on the upper surface of the lower thermal press plate, a lower thermal press head is arranged on the sliding assembly, and a fastening assembly is arranged close to the lower thermal press head and is used for locking the lower thermal press head; and the piston cylinder is arranged on the upper surface of the piston cylinder switching plate, an extending shaft of the piston cylinder is connected with the lower surface of the lower thermal press plate, and the lower surface of the piston cylinder switching plate is in contact with a buffering assembly. The pneumatic hot-press device disclosed by the invention has the advantages of balance pressure, quick and uniform heating, high alignment precision and long-term and reliable operation, and is suitable for large-area thermal press stacking between sheets or between sheets and films, or is suitable for complicated work conditions.

Description

technical field [0001] The invention relates to the technical field of hot-press lamination of flexible electronic layers, in particular to a pneumatic hot-press device, which is suitable for hot-press lamination or composite working conditions of large-area sheets and sheets or sheets and films. Background technique [0002] The emerging electronic technology of fabricating organic / inorganic thin-film electronic devices on flexible substrates, with its unique flexibility / extensibility and high-efficiency, low-cost manufacturing process, has broad application prospects in information, energy, medical, national defense and other fields, such as fuel Batteries, RFID, electronic skin, thin-film solar cells, etc. One of the key technologies of flexible electronic devices is the packaging and manufacturing of flexible electronic components, such as fuel cell membrane electrode assemblies, lithium battery components, solar cell component packaging, etc., involving roll-to-roll ali...

AI Technical Summary

Problems solved by technology

For example, the patent of CN1725535A "Designing Hydrogen Air Fuel Cell MEA Microwave Hot Pressing Method and Device" uses microwave heating and hydraulic jack pressure method, wherein microwave heating has the advantages of fast heating, etc., but microwave radiation is not only harmful to human body, but also heat transfer is slow The distance is related, and the uniformity of heating needs to be considered; the patent CN101697345A relates to a hot-pressing device for manufacturing and packaging flexible electronic devices. This invention uses electric heating and spring control to maintain a stable pressure. Due to the limited pressure of the spring and easy fatigue, the device is difficult to ensure Hot pressing under long-term, stable high-pressure conditions

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