Heat dissipation device

Abstract

The invention relates to a heat dissipation device which comprises a heat dissipation element, a fixed arm, a fixing unit, a first fixing element and a second fixing element, wherein a circuit board is provided with an assembly hole; the fixed arm is fixed on the heat dissipation element; a sliding chute and a first fixed slot communicated with the sliding chute are formed on the fixed arm; the fixing unit comprises a sliding arm and a fixed arm connected with the sliding arm; an accommodating slot and a second fixed slot communicated with the accommodating slot are formed on the sliding arm; a third fixed slot is formed on the fixed arm; the sliding arm is arranged in the sliding chute and can slide along the sliding chute, so that the third fixed slot is aligned with the assembly hole, and the first fixed slot is communicated with the second fixed slot; the first fixing element penetrates through the third fixed slot and locked into the assembly hole, so that the fixed arm is fixed on the circuit board; and the second fixing element penetrates through the first fixed slot and the second fixed slot and is fixedly connected with the sliding arm and the fixed arm.

Description

technical field [0001] The invention relates to the field of computers, in particular to a heat dissipation device suitable for being installed on different types of motherboards and having better heat dissipation efficiency. Background technique [0002] In the prior art, in order to solve the heat dissipation problem of the computer, a heat dissipation module is usually installed on the heating element, so that the heat generated by the heating element, such as a CPU (Central Processing Unit), is exported through the heat dissipation module. The heat dissipation module usually consists of a fan and a heat sink. The fan is fixed on the heat sink by screws. The bottom of the heat sink is attached to the heating element. The heat generated by the heating element is conducted to the heat sink and then blown to the outside world. In the prior art, in order to facilitate heat dissipation, that is, the heat dissipated by the CPU can be quickly transferred to the heat sink for he...

AI Technical Summary

Problems solved by technology

[0004] However, for different types of motherboards, such as motherboards with different sizes and configurations, the installation positions and numbers of the mounting holes are usually different. And fully fit the CPU on the main board, usually need to design and manufacture a heat sink that matches the main board, the specific requirements are the setting position and quantity of the fixing holes on the heat sink and the setting of the mounting holes on the main board The position and quantity are corresponding and matched, so the same heat sink cannot be applied to different types of motherboards, that is, different types of motherboards cannot be compatible with the same heat sink, and different motherboards need to be replaced with different heat sinks, resulting in increased manufacturing costs and resources. waste

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