Efficient isothermal forging mould base
A technology of isothermal die forging and die base, which is applied in forging/pressing/hammer devices, forging/pressing/hammering machinery, manufacturing tools, etc., which can solve the waste of manpower, material and financial resources, increase production input costs, and reduce heating efficiency and other issues, to achieve the effect of saving resources, reducing costs, and small residual stress
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2012-09-19
- Estimated Expiration
- Not applicable · inactive patent
Smart Images

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Abstract
Description
technical field
[0001] The invention relates to a mold seat for high-efficiency isothermal die forging. Background technique
[0002] The die base for isothermal die forging is suitable for the manufacture of superalloy parts and titanium alloy integral impellers, compressor discs and aircraft structural parts that require strict control of the deformation temperature range. However, since isothermal die forging requires a heating device that can maintain a constant temperature during the deformation process, if the temperature cannot be maintained at a constant value during the deformation process, the heating efficiency of the die base for isothermal die forging will be reduced and affect the work efficiency. Increase the cost of production input, and waste a lot of manpower, material and financial resources. Contents of the invention
[0003] Purpose of the invention: the purpose of the present invention is to solve the deficiencies in the prior art, and to provide a d...
Examples
Embodiment Construction
[0010] Below in conjunction with accompanying drawing, further illustrate the present invention
[0011] like figure 1 Shown is the structural representation of the present invention, and it comprises upper support plate 1, upper insulation board 2, upper cover 3, upper mold frame 4, upper mold 5, lower mold 6, lower mold frame 7, lower cover 8, inductor 9, hole 10, lower insulation board 11 and lower support board 12.
[0012] Described lower mold 6 is provided with blank 15, and upper mold 5 and lower mold 6 are respectively fixed on upper mold frame 4 and lower mold frame 7, and the outer side of upper mold frame 4 and lower mold frame 7 is respectively provided with upper cover 3 And the lower sleeve 8, the upper mold frame 4 is connected with the upper support plate 1 through the upper heat insulation plate 2, the lower mold frame 7 is connected with the lower support plate 12 through the lower heat insulation plate 11, and the axial end surface of the lower sleeve 8 is ...