Centrifugal abrasive material projection machining device

A processing device and centrifugal technology, which is applied in the direction of abrasive jet machine tools, abrasives, explosion generating devices, etc., can solve the problems of uneven distribution and small projected area, and achieve the effect of large projected area, high metal removal rate and uniform distribution

Inactive Publication Date: 2012-09-19
TAICANG KAIXIN ELECTRONICS
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0002] Free abrasive processing device is a processing method with a long history and continuous development. It refers to a processing device that does not cut or removes a very thin material layer to reduce the roughness of the workpiece surface or strengthen the surface of the workpiece. The current free abrasive Due to the immature technology of processing devices, there are still shortcomings such as small projected area and uneven distribution.

Method used

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  • Centrifugal abrasive material projection machining device
  • Centrifugal abrasive material projection machining device

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Embodiment Construction

[0010] Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various aspects of the present invention Modifications in equivalent forms all fall within the scope defined by the appended claims of this application.

[0011] as attached figure 1 As shown, a centrifugal abrasive projection processing device includes an abrasive liquid tank 1, an abrasive mixed liquid 2, an impeller 3, a blade 4, a workpiece 5, and a pump 6; the center of the impeller 3 is provided with a feed port 8, and the The blade 4 is arranged in the impeller 3 and is vertically connected with the feed port 8, the abrasive liquid tank 1 is arranged below the impeller 3, the workpiece 5 is arranged on the cover pla...

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Abstract

The invention discloses a centrifugal abrasive material projection machining device, comprising an abrasive material liquid tank, abrasive material mixed liquid, an impeller, a blade, a working piece, a pump and an abrasive material. A feeding opening is arranged at the center of the impeller; the blade is arranged in the impeller and is vertically connected with the feeding opening; the abrasive material liquid tank is arranged below the impeller; the working piece is arranged on a cover plate of the abrasive material liquid tank; the abrasive material mixed liquid is mounted in the abrasive material liquid tank; the abrasive material liquid tank is connected with the pump; and the pump is connected with the feeding opening through a guide pipe. According to the centrifugal abrasive material projection machining device provided by the invention, the working piece is machined by using a centrifugal force to project the abrasive material through the rotation of the impeller. The centrifugal abrasive material projection machining device has the advantages of large projection area, uniform distribution and high metal cutting ratio. Furthermore, the centrifugal abrasive material projection machining device provided by the invention is simple in structure, has low manufacturing cost, and is convenient for industrial production.

Description

technical field [0001] The invention relates to a workpiece processing device, in particular to a centrifugal abrasive projection processing device. Background technique [0002] Free abrasive processing device is a processing method with a long history and continuous development. It refers to a processing device that does not cut or removes a very thin material layer to reduce the roughness of the workpiece surface or strengthen the surface of the workpiece. The current free abrasive Due to the immature technology of the processing devices, there are also disadvantages such as small projected area and uneven distribution. Contents of the invention [0003] Purpose of the invention: In view of the above problems, the purpose of the present invention is to provide a centrifugal abrasive blasting processing device with large projection area, uniform projection distribution and high metal removal rate. [0004] Technical solution: a centrifugal abrasive projection processing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24C3/02B24C5/06
Inventor 王平
Owner TAICANG KAIXIN ELECTRONICS
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