Centrifugal abrasive material projection machining device

Abstract

The invention discloses a centrifugal abrasive material projection machining device, comprising an abrasive material liquid tank, abrasive material mixed liquid, an impeller, a blade, a working piece, a pump and an abrasive material. A feeding opening is arranged at the center of the impeller; the blade is arranged in the impeller and is vertically connected with the feeding opening; the abrasive material liquid tank is arranged below the impeller; the working piece is arranged on a cover plate of the abrasive material liquid tank; the abrasive material mixed liquid is mounted in the abrasive material liquid tank; the abrasive material liquid tank is connected with the pump; and the pump is connected with the feeding opening through a guide pipe. According to the centrifugal abrasive material projection machining device provided by the invention, the working piece is machined by using a centrifugal force to project the abrasive material through the rotation of the impeller. The centrifugal abrasive material projection machining device has the advantages of large projection area, uniform distribution and high metal cutting ratio. Furthermore, the centrifugal abrasive material projection machining device provided by the invention is simple in structure, has low manufacturing cost, and is convenient for industrial production.

Description

technical field [0001] The invention relates to a workpiece processing device, in particular to a centrifugal abrasive projection processing device. Background technique [0002] Free abrasive processing device is a processing method with a long history and continuous development. It refers to a processing device that does not cut or removes a very thin material layer to reduce the roughness of the workpiece surface or strengthen the surface of the workpiece. The current free abrasive Due to the immature technology of the processing devices, there are also disadvantages such as small projected area and uneven distribution. Contents of the invention [0003] Purpose of the invention: In view of the above problems, the purpose of the present invention is to provide a centrifugal abrasive blasting processing device with large projection area, uniform projection distribution and high metal removal rate. [0004] Technical solution: a centrifugal abrasive projection processing...

AI Technical Summary

Problems solved by technology

[0002] Free abrasive processing device is a processing method with a long history and continuous development. It refers to a processing device that does not cut or removes a very thin material layer to reduce the roughness of the workpiece surface or strengthen the surface of the workpiece. The current free abrasive Due to the immature technology of processing devices, there are still shortcomings such as small projected area and uneven distribution.

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